One Component Epoxy

Void-Free Bond Lines

Long term durability of epoxy adhesive compounds for bonding similar/dissimilar substrates and maintaining their stability when exposed to an assortment of environmental characteristics is of prime importance in diverse applications. Void-free bond lines can be achieved by preventing air entrapment that can have multiple causes such as poor wetting or improper dispensing.

One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability

Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)]. It can be applied in ultra thin bond lines and contains particles with an average size of 2-3 microns. Most importantly EP3HTSDA-2 exhibits very low thermal resistance of 2-3 x 10 -6 K•m2/W. It also has outstanding electrical conductivity with a volume resistivity less than 0.001 ohm-cm.

EP3HTSDA-2 meets NASA low outgassing specifications and is serviceable from -80°F to +450°F [-62°C to +232°C]. This product adheres well to similar/dissimilar substrates such as aluminum, ceramic, copper, fiberglass, polyimide and silicone die. This formulation is designed to cure in 20-30 minutes at 250°F or 5-10 minutes at 300°F. Die shear strength has a 20-20 Kg-f value at 75°F measured for a die size of 2x2 mm [80x80 mil].

EP3HTSDA-2 is packaged in syringes or glass jars. Common sizes range from 20 grams, 50 grams, 100 grams to one and multiple pound units. For storage simple refrigeration is recommended. Shelf life is a minimum of 3 months in original unopened syringes or jars.

Hydraulic Machinery and Equipment

From fork lifts to cranes to loaders to car braking systems to shovels to hydraulic presses for forging metals durable ready to use Master Bond adhesives/sealants offer flexible design solutions. Our products are engineered to adhere well to a broad range of substrates such as plastics, metals, eradicate leak paths, lower costs, extend longevity of hydraulic machinery.

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6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability

Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material. This test indicates a consistent product performance for temperatures up to 200°C.

MIL-STD-883 section 3.8.5 defines that thermal stability testing should be done by performing a thermogravitmetric analysis (TGA) according to ASTM D3850. TGA is the study of a material’s weight change as a function of temperature and time under a controlled atmosphere. It can be used to determine the thermal stability of a material.

To evaluate the material, samples are placed in a nitrogen atmosphere (20-30mL/min flow). The measurement of the samples start at room temperature (25°C) and then continues as the samples get heated 10°C/min up to a final temperature of 200°C. During this assessment, the weight of the samples is continuously measured. A material passes this standard if the weight loss at 200°C is less than or equal to 1.0 percent of the cured material weight. Three samples are tested and the average value of the three must meet or exceed the minimum requirements.

To date, Master Bond has sent 6 epoxy adhesives for this test through an independent lab. All six have passed the MIL-STD-883J, Method 5011 (sect. 3.5.2 & 3.8.5), tested in accordance with ASTM D3850.

For a full product description for each of the six products tested, please visit the following pages:

Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity

Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of over 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids formulation has an ideal viscosity and flow for die attach, will not ‘tail’ and can be easily dispensed automatically” says Rohit Ramnath, senior product engineer. “Additionally it has an unlimited working life at room temperature and will cure in 20-30 minutes at 250°F or 5-10 minutes at 300°F.”

Master Bond EP3HTSDA-1 is NASA low outgassing approved. Dimensionally stable, it has a Shore D hardness of 75-85 and is engineered to withstand thermal cycling and shock. This epoxy system adheres well to metals, ceramics, and silicon dies. Service operating temperature range is from -80°F to +400°F.

This product contains silver fillers and has a volume resistivity of <0.001 ohm-cm. It retains conductivity upon aging and provides excellent moisture and chemical resistance. This compound is formulated for applications in the communication, aerospace, medical, electronic, automotive, and defense industries. Master Bond EP3HTSDA-1 is available for use in syringe applicators.

Emergency Vehicles

Custom formulated epoxies for emergency vehicle equipmentOptimize productivity, lower manufacturing costs, improve reliability, performance, safety, aesthetics with Master Bond structural adhesives, seam sealants and form-in-place gasketing.

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One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion

Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. “EP13LTE is very convenient to use, since it doesn’t require mixing, and has an unlimited working life at room temperature,” said Venkat Nandivada, manager of technical support. “Besides being easy to handle, this system also offers superior resistance to high temperatures, with a glass transition temperature of approximately 160°C.”

EP13LTE cures readily in 1-2 hours at 300-350°F. This epoxy paste has limited flow while curing. It bonds well to many substrates such as metals, glass, composites, ceramics and plastics. Once cured, EP13LTE has an impressive strength profile delivering a tensile lap shear strength of 2,600-2,800 psi, a compressive strength of 24,000-26,000 psi and a tensile modulus of 500,000-550,000 psi. This dimensionally stable system is able to withstand 1,000 hours at 85°C/85% RH and maintain a Shore D hardness of 90.

With a volume resistivity exceeding 1015 ohm-cm, EP13LTE has reliable electrical insulation properties. This system also passes ASTM E595 testing for NASA low outgassing. It is serviceable over the wide temperature range of -60°F to +500°F [-51°C to +260°C]. This tan colored system is available for use in syringes, jars, ½ pints and pint containers.

Adhering to Painted Metals

Most adhesives should be able to bond to a painted surface. However, if longevity is of concern, the removal of the paint is often recommended, since the bond strength to the bare metal of an epoxy adhesive for example, could be as much as 2-3 times the bond strength achieved on a painted metal surface. Please see table below:

High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. “EP17HTDA-1 has the ideal viscosity and flow for die attach applications,” said Rohit Ramnath, senior product engineer. “It has a high glass transition temperature (Tg) and also offers excellent electrical insulation properties, even at elevated temperatures and low exotherm upon curing.” This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2.

EP17HTDA-1 has exceptional temperature resistance with a service temperature range of -80°F to +600°F [-62°C to +316°C] and a Tg of 195-205°C. This compound boasts thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)]. It withstands a variety of chemicals including acids, bases, salts, fuels, oils and many solvents.

As a one part system, EP17HTDA-1 does not require any mixing for use and is curable in the temperature range of 300-350°F in short durations. It bonds well to a wide variety of substrates, such as metals, ceramics, plastics and composites. Upon curing, it delivers a tensile lap shear strength of 2,400-2,600 psi and a tensile strength of 9,000-10,000 psi. It also has minimal shrinkage upon curing.

While EP17HTDA-1 is well suited for electronic and related applications, it can also be used in vacuum situations as it passes NASA low outgassing testing. This epoxy is available for use in 10 cc and 30 cc syringes and has a shelf life of 3-6 months when stored at 40-50°F.

Precise Alignment Stability

Multiple Master Bond adhesive systems were developed to ensure exact alignment retention in structural bonding applications. The need for these formulations has grown significantly as thinner, lighter, durable, miniaturized electronic/optical devices require precise tolerances for adhering similar/dissimilar substrates subjected to fluctuations in temperatures, stresses, moisture,

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