OEM

One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability

Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)]. It can be applied in ultra thin bond lines and contains particles with an average size of 2-3 microns. Most importantly EP3HTSDA-2 exhibits very low thermal resistance of 2-3 x 10 -6 K•m2/W. It also has outstanding electrical conductivity with a volume resistivity less than 0.001 ohm-cm.

EP3HTSDA-2 meets NASA low outgassing specifications and is serviceable from -80°F to +450°F [-62°C to +232°C]. This product adheres well to similar/dissimilar substrates such as aluminum, ceramic, copper, fiberglass, polyimide and silicone die. This formulation is designed to cure in 20-30 minutes at 250°F or 5-10 minutes at 300°F. Die shear strength has a 20-20 Kg-f value at 75°F measured for a die size of 2x2 mm [80x80 mil].

EP3HTSDA-2 is packaged in syringes or glass jars. Common sizes range from 20 grams, 50 grams, 100 grams to one and multiple pound units. For storage simple refrigeration is recommended. Shelf life is a minimum of 3 months in original unopened syringes or jars.

Hydraulic Machinery and Equipment

From fork lifts to cranes to loaders to car braking systems to shovels to hydraulic presses for forging metals durable ready to use Master Bond adhesives/sealants offer flexible design solutions. Our products are engineered to adhere well to a broad range of substrates such as plastics, metals, eradicate leak paths, lower costs, extend longevity of hydraulic machinery.

Undefined

6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability

Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material. This test indicates a consistent product performance for temperatures up to 200°C.

MIL-STD-883 section 3.8.5 defines that thermal stability testing should be done by performing a thermogravitmetric analysis (TGA) according to ASTM D3850. TGA is the study of a material’s weight change as a function of temperature and time under a controlled atmosphere. It can be used to determine the thermal stability of a material.

To evaluate the material, samples are placed in a nitrogen atmosphere (20-30mL/min flow). The measurement of the samples start at room temperature (25°C) and then continues as the samples get heated 10°C/min up to a final temperature of 200°C. During this assessment, the weight of the samples is continuously measured. A material passes this standard if the weight loss at 200°C is less than or equal to 1.0 percent of the cured material weight. Three samples are tested and the average value of the three must meet or exceed the minimum requirements.

To date, Master Bond has sent 6 epoxy adhesives for this test through an independent lab. All six have passed the MIL-STD-883J, Method 5011 (sect. 3.5.2 & 3.8.5), tested in accordance with ASTM D3850.

For a full product description for each of the six products tested, please visit the following pages:

Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity

Master Bond MasterSil 170 Gel is a two component system with excellent flowability for potting and encapsulation applications. It possesses a low mixed viscosity of 1,000 cps, has a long working life after mixing (2-4 hours for 100 g batch), a low exotherm upon cure and is easy to dispense. This solvent free silicone product does not require exposure to air for cross-linking. It has a convenient one to one mix ratio by weight and will cure at 75°F or more quickly at elevated temperatures.

“MasterSil 170 Gel has excellent optical clarity” says Rohit Ramnath, Senior Product Engineer. “It has a low refractive index of 1.42. Additionally, it exhibits outstanding electrical insulation properties, can cure in thicknesses beyond 1 inch, protects sensitive electronic/optical components against thermal stresses. Most notable for MasterSil 170 Gel is the ability it offers to retrieve delicate components after cure.”

This versatile composition is highly resistant to water, is able to withstand severe thermal cycling without cracking and has extremely low shrinkage upon cure. This soft, pliable and compliant silicone system is repairable and its hardness penetration is 65 mm. MasterSil 170 Gel is available for use in ½ pint, pint, quart, gallon and 5 gallon kit containers. Shelf life in original, unopened containers at 75°F is 6 months.

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion

Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications. It is also effective in bonding fragile components requiring a low coefficient of thermal expansion. EP42HT-3AO is designed to optimize heat dissipation properties, improve the quality and reliability of electronic devices subjected to thermo-mechanical stresses.

This compound combines a low CTE of 13-16x10-6 in/in/°C with a high glass transition temperature (Tg) of 140-150°C. It has a thermal conductivity of 11-12 BTU•in/ft²•hr•°F [1.59-1.73 W/(m•K)]. It also exhibits low shrinkage upon curing, dimensional stability, and excellent structural strength. EP42HT-3AO is a reliable electrical insulator with a volume resistivity of >1014 ohm-cm. This system is serviceable from -100°F to +400°F.

This 100% reactive epoxy formulation has a non-critical 100 to 40 mix ratio by weight and a working life of 60-90 minutes after mixing for a 100 gram batch at 75°F. It has a recommended cure schedule of overnight at room temperature, followed by 2-3 hours at 150-200°F. EP42HT-3AO is available for use in ounce, ½ pint, pint, quart and gallon kit containers. Specialty packaging options in the form of pre-mixed and frozen syringes are also available. The specialty packaging allows for automated dispensing. The color of Part A is white and Part B is off-white.

Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in shadowed out areas. “It is designed to cure in 10-30 seconds at 365nm with 10-40 mW/cm2 of UV output, followed by a post cure at 180°F (~80°C) for 30-60 minutes. This system has been specially designed for applications involving heat sensitive components”, says Rohit Ramnath, Senior Product Engineer. “The product is serviceable from -60°F to 350°F (-51°C to 177°C) and it offers a lower coefficient of thermal expansion 30-35 x 10-6 inch/inch/°C compared to other UV curing systems.”

Master Bond UV22DC80-10F is 100% solids and is not oxygen inhibited. It is capable of curing up to thicknesses of around 0.050 inches. The product can be used for bonding, sealing, coating and glob-top type applications. It has a refractive index of 1.52 at 589 nm. It is available for purchase in 10 cc and 30 cc syringes, ounce jars, ½ pint, 1 pint, and quart containers. The shelf life at 40-50°F is 6 months in the original unopened containers.

Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F

Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils. Serviceable from -80°F to +500°F this solvent free formulation has a working life of more than 24 hours per 100 gram batch at room temperature. It has good flow properties, a mixed viscosity of 7,000-20,000 cps, a mix ratio of 100 to 50 by weight and cures upon exposure to heat. This product can be dispensed manually or via automated dispensing systems.

“This unique compound offers outstanding long term durability. It adheres well to both similar and dissimilar substrates such as metals, glass, ceramics and plastics,” said Rohit Ramnath, senior product engineer. “It can be used to replace traditional mechanical fastening techniques in applications requiring high temperature and chemical resistance.”

Master Bond Supreme 34CA has a tensile lap shear strength >2,500 psi and a tensile strength >12,000 psi. This electrically insulative epoxy has a volume resistivity of >1014 ohm-cm. It also features a Tg of 200-210°C and a Shore D hardness of >75.

The color of Part A is black and Part B is amber. It is available for use in ½ pint, pint, quart, gallon, 5 gallon pail kits and in gun applicators. Supreme 34CA can be used as a corrosion resistant coating, as well as for bonding, sealing and filament winding applications.

Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance

Master Bond MasterSil 151TC was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. This 100% solids silicone compound features a thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/(m•K)] and superior electrical insulation properties. Volume resistivity is >1014 ohm-cm. “This two component, room temperature curing formulation contains a special blend of ultra fine thermal conductive fillers and can be applied in very thin sections”, said Venkat Nandivada, manager of technical support. “This significantly enhances its heat transfer capabilities. Thermal resistance for MasterSil 151TC is an impressive 7-10 x 10-6 K•m2/W.”

Additionally this product was designed to guard against hostile environmental conditions. It has excellent resistance to water and can withstand exposure to rigorous vibration, impact, shock, thermal cycling, salt spray, and airborne contaminants. Shrinkage upon cure is low. MasterSil 151TC has good flow properties, an elongation of 90-110% and a Shore A hardness of 80-90. It adheres well to most substrates without the use of primers. Serviceability is from -65°F to +400°F.

MasterSil 151TC has a working life of 2-4 hours for a 100 gram batch at 75°F. Most importantly this composition has a low exotherm upon cure. The color of Part A is white, Part B is clear. This durable product can be dispensed on complex shapes and delivers cost effective, reliable long term performance. It may be used in LED lighting, automotive, semiconductor packaging, communication, consumer electronic and energy industries. MasterSil 151TC is available for purchase in ounce, ½ pint, pint, quart kits.

Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity

Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of over 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids formulation has an ideal viscosity and flow for die attach, will not ‘tail’ and can be easily dispensed automatically” says Rohit Ramnath, senior product engineer. “Additionally it has an unlimited working life at room temperature and will cure in 20-30 minutes at 250°F or 5-10 minutes at 300°F.”

Master Bond EP3HTSDA-1 is NASA low outgassing approved. Dimensionally stable, it has a Shore D hardness of 75-85 and is engineered to withstand thermal cycling and shock. This epoxy system adheres well to metals, ceramics, and silicon dies. Service operating temperature range is from -80°F to +400°F.

This product contains silver fillers and has a volume resistivity of <0.001 ohm-cm. It retains conductivity upon aging and provides excellent moisture and chemical resistance. This compound is formulated for applications in the communication, aerospace, medical, electronic, automotive, and defense industries. Master Bond EP3HTSDA-1 is available for use in syringe applicators.

Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life

Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, a dielectric constant of 2.91 at 1 KHz and a dissipation factor of 0.009 at 1KHz. “EP110F8-5 is an easy to use, heat curing epoxy that is ideal for applications where dimensional stability, electrical insulation properties and thermal cycling resistance are required,” said Rohit Ramnath, senior product engineer.

This two component epoxy has a very forgiving one to two mix ratio by weight with a moderate mixed viscosity of 7,000-11,000 cps and good flow properties. It requires an elevated temperature cure at 250-300°F in 4-6 hours. EP110F8-5 has a very long pot life of 2-3 days at room temperature.

EP110F8-5 is a rigid system with a Shore D hardness of 70-80, but also maintains excellent toughness and offers an elongation of 40-60%. Its toughness imparts an ability to withstand thermal cycling as well as impact and vibration. In fact, it passes 10 thermal shock cycles of -55°C to +125°C. With a compressive strength of 18,000-20,000 psi, EP110F8-5 adheres well to a wide variety of substrates, including metals, composites, glass and many plastics. It resists exposure to water, oils and fuels.

It is serviceable over the wide temperature range of -100°F to +300°F [-73°C to +149°C]. Part A of EP110F8-5 is tan in color and Part B is brown. This system is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits.

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