EP21HT Product Information

EP21HT Two Part Epoxy System

Two Component, Room Temperature Curing Adhesive, Sealant & Coating Featuring Convenient 1:1 Mix Ratio and High Temperature Serviceability Up To 400°F Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications

EP21TCHT-1 Product Information

EP21TCHT-1 Two Part Epoxy Adhesive

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.

EP21TDC-4HT Product Description

EP21TDC-4HT Two Part Epoxy

Two Component, Toughened Epoxy Compound For High Performance Bonding, Sealing And Casting Featuring High Peel Strength Resistance To Vibration Impact And Shock For Service Up to 400°F.

EP21TDCHT Product Information

EP21TDCHT Two Part Epoxy

Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance.

EP21TDCHT-1 Product Information

Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance

EP21TDCHT-LO Product Information

EP21TDCHT-LO Two Component Epoxy Adhesive

Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance. Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.

EP21TPHTAO Product Description

EP21TPHTAO Two Part Polysulfide/Epoxy

Two Component Thermally conductive Polysulfide/Epoxy Adhesive/Sealant For High Performance Bonding and Sealing

EP30-2 Product Information

EP30-2 Two Part Epoxy Compound

Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity; Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.

EP30-3 Product Information

EP30-3 Two Part Epoxy Compound

Two Component, Low Viscosity, Optically Clear Epoxy Featuring Outstanding Temperature and Chemical Resistance for Service up to 450°F. Requires Heat Curing at 250-300°F.

EP30ANHT Product Description

EP30ANHT Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for Bonding, Sealing, Coating & Encapsulation with Exceptional Thermal Conductivity, Electrical Isolation and High Temperature Resistance.

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