Expanded Product List
Master Bond Product Search
105 products match
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EP3HTSCN Silver coating nickel filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F. |
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EP3HTSDA-1 Silver filled electrically conductive, die attach epoxy has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +400°F. |
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EP3HTSDA-2 Silver filled electrically conductive epoxy has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive with incredibly low thermal resistance. Smooth paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +450°F. |
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EP3HTSDA-2Med Silver filled electrically conductive epoxy has a rapid cure speed. Meets ISO 10993-5. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive with incredibly low thermal resistance. Smooth paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +450°F. |
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EP3HTSMed One part, silver conductive epoxy adhesive. USP Class VI approved. Rapid cures at elevated temperatures. Thixotropic paste. Serviceable from -60°F to +400°F. High shear strength. Excellent thermal and electrical conductivity. Exceptionally low resistivity. |
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EP3LV One component heat curing epoxy adhesive. Outstanding dimensional stability. Does not contain any solvents or diluents. Superior tensile shear strength. Adhesive spreads evenly and smoothly. Easy to dispense. Thermal insulator. Serviceable from -100°F to +300°F. |
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EP3RR-1 Thermally conductive/electrically insulative epoxy formulation for potting/encapsulation and underfill applications. No mix system. Rapid curing with versatile cure schedules Good flow properties. Dimensionally stable. Available in syringes for manual or automatic dispensing. Serviceable from -60°F to +350°F. |
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EP3RR-80 Moderate viscosity with excellent flow properties. One part system featuring cures at 80°C or higher. Superior thermal conductor. Excellent electrical insulator. Low exotherm while curing. Outstanding mechanical strength properties. Withstands 1,000 hours 85°C/85% RH. Passes NASA low outgassing tests. Serviceable from -100°F to +350°F. |
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EP3RRLV One part oven cured system (125-150°C) for potting, encapsulation and underfill applications. Good dimension stability and very easy to use. Cures rigid. Thermally conductive/electrically insulative. Excellent flow properties. Superior mechanical strength. Can be cast up to 1 inch thick. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +350°F. |
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EP3SP5FL Single component snap cure adhesive. Unsurpassed curing speed of 1-2 minutes at 300°F. Moderate viscosity with good flow properties. Easy to dispense. Good tensile lap shear strength. Repairable. Serviceable from -60°F to +200°F. |