Electrically Conductive Adhesives Make Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.

Spotlight on Silicones

Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering properties.

Abrasion Resistant, Flexible Adhesive is Serviceable at Cryogenic Temperatures

Master Bond elastomer system, EP30D-10, offers the strength, flexibility, performance, and adhesive qualities traditionally associated with epoxies, along with the toughness and abrasion resistance of polyurethanes. This two component adhesive is resistant to thermal cycling and chemicals including water, inorganic salts, acids, and alkalis.

Serviceable over the wide temperature range of 4K to 220°F, EP30D-10 has been successfully used in numerous cryogenic applications. It cures at room temperature, or more rapidly at elevated temperatures. Parts more than an inch thick can be cast and cured without undue exothermic development. Featuring excellent electrical insulation properties and optical clarity, EP30D-10 is often used in casting and encapsulation applications in the electronic, aerospace, OEM, MRO, and optical industries.

Once cured, this flexibilized system develops a tensile strength of 1,500 psi and an elongation exceeding 150% at 75°F. It bonds well to a variety of substrates including, metals, wood, concrete, glass, vulcanized rubbers, and many plastics. This 100% reactive adhesive does not contain any solvents or diluents and is formulated to cure with minimal shrinkage.

Both parts of EP30D-10 are clear and have a 100:05 mix ratio by weight, with a mixed viscosity less than 100,000 cps, and a long working life of 180 minutes at room temperature for a 100 gram mass. With a shelf life of 1 year at room temperature (in its original packaging), it is available for use in half pint, pint, quart, gallon, and 5 gallon container kits.

New Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved

Developed for rigorous bonding and sealing in demanding manufacturing applications, Master Bond EP3HTSMed epoxy system features a rapid cure schedule and a tensile shear strength exceeding 1,000 psi. It is 100% reactive and fully meets USP Class VI requirements for medical applications.

This silver-filled epoxy adhesive/sealant has remarkable electrical conductivity with a volume resistivity less than 0.001 ohm cm. Serviceable over the wide temperature range of -60°F to 400°F, EP3HTSMed is resistant to severe thermal cycling and many chemicals including water, fuels, oil, and most organic solvents.

EP3HTSMed is a thixotropic paste and has a specific gravity of 2.90 at 77°F. It requires no mixing and needs only contact pressure during a simple heat cure of 20 to 40 minutes at 300°F or 40 to 90 minutes at 250°F. With minimal shrinkage during cure and a Shore D hardness of 60 to 80, EP3HTSMed bonds well to a variety of substrates including metals, glass, vulcanized rubbers, ceramics, and many plastics.

Silver in color, this one component adhesive is packaged in syringes or glass jars. EP3HTSMed has a shelf life of 6 months in a glass jar and a shelf life 3 months when stored in a syringe at room temperature.

Truck and Trailer Industry

Adhesives for Truck and Trailer Applications Master Bond structural adhesives improve productivity and reliability in assembly operations. Products are designed to withstand harsh climactic conditions and improve durability.

Undefined

Medical Grade Epoxy Adhesive Withstands High Temperatures and Repeated Sterilization

Capable of tolerating the harsh environments of the medical industry, Master Bond EP42HT-2ND2Med Black fully complies with the testing requirements of USP Class VI plastics. This two component epoxy resists recurrent autoclaving and sterilizations including radiation, steam, ethylene oxide, and chemical sterilants.

EP42HT-2ND2Med Black is an excellent electrical insulator with a volume resistivity over 1012 ohm-cm, a thermal expansion coefficient of 35 to 40 in/in x 10-6/°C, a dielectric constant of 3.8, and a tensile strength exceeding 12,000 psi at ambient temperatures. Heat resistant up to 450°F, it also withstands chemicals such as inorganic and organic acids, alkalis, organic solvents, and aromatic hydrocarbons.

This epoxy conveniently cures at room temperature in 48 to 72 hours. Its optimal curing schedule is overnight at room temperature followed by 2 to 3 hours of heat curing at 100°C to 125°C. EP42HT-2ND2Med Black has a noncritical mix ratio of 100:40 by weight or 100:50 by volume, and a paste consistency with minimal flow when applied. It offers a lengthy working life of 30 to 45 minutes for a mixed 100 gram batch at ambient temperatures, which can be increased by using shallow mixing vessels or mixing smaller batches. Parts A and B for EP42HT-2ND2Med Black are available for use in syringes, half pints, pints, quarts, gallons, and five gallon containers.

Thermal Conductive Adhesive has Convenient One to One Mix Ratio

Master Bond EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., Hackensack, N.J. this compound is extremely versatile and will adhere well to variety of similar and dissimilar substrates. It has a low coefficient of expansion, low shrinkage and superb dimensional stability. It also exhibits superior durability and chemical resistance.

EP21AO is easy to apply and is a self leveling paste. It is 100% reactive and does not contain any solvents or volatiles. It has a thermal conductivity of 10BTU/in/ft²/hr/°F and a dielectric strength of >400 volts/mil. Its volume resistivity is >10¹³ ohm cm. EP21AO has a Shore D hardness of >85 and a tensile strength of 5,000psi. Service operating temperature range is -60°F to +250°F.

Master Bond EP21AO is available for use in pint, quart, gallon and 5 gallon container kits.

New Fast Curing Epoxy Adhesive

Master Bond Inc. of Hackensack, New Jersey has developed EP24, new fast curing, two component epoxy adhesive. This high performance system cures at room temperature or more rapidly at elevated temperatures. Additionally, it will cure at colder temperatures, down to 20°F. It is easy to use and has a convenient non critical mix ratio of 1 to 1 by weight or volume. The adhesive spreads evenly and smoothly. It is 100% reactive and contains no volatiles or solvents.

Master Bond EP24 is durable, tough and resistant to thermal cycling and chemicals. It has high bond strength to many similar and dissimilar substrates. It quickly develops a high bonding strength of more than 3,000 psi at room temperature. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. It has a service operating temperature range of -300°F to +250°F.

EP24 is available in pint, quart, gallon and 5 gallon container units. It is also available in syringe and gun applicators.

One Component Silver Conductive Adhesive System Meets NASA Outgassing Test Requirements

Master Bond Polymer System Supreme10HT/S is a uniquely formulated silver filled one component epoxy compound with an unsurpassed wide service temperature range from cryogenic service temperatures up to as high as 400°F. This remarkably versatile electrically conductive epoxy composition features high physical strength properties, superior chemical resistance and excellent durability even when exposed to various severe environmental conditions. Additionally it fully meets NASA low outgassing requirements.

Supreme 10HT/S has a shelf life of 3 months at ambient temperatures. The shelf life can be readily extended by storage at lower temperatures. No mixing is needed for use. Cure can be effected by heating at 250°F for approx. 1 hour or 300°F for 30 minutes, less at higher temperatures. A snap cure version called Supreme 10HTSF is available which will cure at 380-400°F in less than 2 minutes. Supreme 10HT/S has excellent bonding properties. Lap shear strengths with properly prepared substrates exceed 1800psi and peel strengths are impressively high. Master Bond Supreme 10HT/S has been acclaimed for outstanding resistance to thermal cycling, mechanical shock and vibration.

High Temperature Resistant Epoxy Offers Outstanding Chemical Resistance

Master Bond Inc. of Hackensack, New Jersey has developed a new two component epoxy system for service above 500°F. Called EP125, this compound is designed to withstand exposure to boiling acids, alkalis, salts, fuels and most organic solvents. It offers high bond strength to metallic and nonmetallic surfaces. Typical lap shear strengths are in the order of 2,400-2,500 psi at ambient temperatures. After heat aging for 1,000 hours at 500°F, slightly less than 50% of the original bond strength is retained. Castings exhibit flexural strength as high as 15,000 psi and flexural moduli of more than 500,000 psi.

Master Bond EP125 has a convenient mix ratio of 2 to 1 by weight. It requires an elevated temperature cure. Cure cycles can be widely adjusted so as to best meet specific processing needs. It has a storage stability of 6 months when stored at ambient temperatures in the original closed containers. EP125 is available in 1/2 pint, pint, quart, gallon and 5 gallon pail kits.

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