Master
Bond has formulated a line of one component epoxy underfill compositions
which feature rapid cures at moderately elevated temperatures and offer
excellent underfill-to-die passivation as well as outstanding adhesion
to a variety of substrates. They exhibit remarkably
fast cures of 25-30 minutes at 250°F or
as little as 10-15 minutes at 300°F. Their shelf life at ambient
temperatures is a minimum of 3 months and a maximum of
6 months. These new underfills are 100% reactive and do
not contain any volatiles.
The new Master Bond line of epoxy underfills contains low viscosity,
highly flowable compounds that produce uniform void-free
epoxy layers for enhancing the protection of the active
die surfaces and improve stress distribution away from
solder interconnects. Master Bond, furthermore, has formulated
no flow fluxing underfill whose use greatly simplifies
conventional flip chip assemblies, some of which can be
fully cured during standard reflux cycles in-line processing.
Both highly insulative and thermally conductive compounds
are available. They all feature superior resistance to
thermal temperature cycling as well as to mechanical shock
and vibration.
High Reliability- High-Purity
- Improved Toughness
- Low Stress
- Low Shrinkage
- Excellent Adhesive Properties
- Outstanding Electrical Insulation
- Superior Thermal Conductivity
- High Temperature Resistant
- Environmentally Friendly
- Withstands Thermal Cycling
- Easily Dispensed
Contact our world class technical staff today,
and let us recommend a Master Bond product specifically for
your application.
Micro Electro-Mechanical Systems
