The Latest Developments from the Master Bond Labs...
Master Bond EP62-1LPSP delivers an array of strength, electrical and handling properties that are well suited for bonding, sealing, coating and encapsulation applications. With a tensile lap shear strength exceeding 2,000 psi, it bonds well to a variety of substrates including metals, composites, glass and many plastics.
Master Bond EP42HT-2LTE is often chosen for a variety of bonding, sealing, coating and select casting applications in the electronic, aerospace, optical and specialty OEM industries. This two component epoxy has a flowable paste consistency that enables precise alignment with minimal fixturing. It cures at room temperature or more quickly with the addition of heat.
Well suited for bonding dissimilar substrates, Master Bond UV15X-2 is a one part UV curable adhesive, sealant, coating and potting compound. This versatile system combines a high performance physical profile with very low shrinkage upon curing. It is widely employed in fiber-optic, optical, electronic, microelectronic, semiconductor and laser applications.
Formulated to operate over the wide temperature range of -80°F to +650°F, Master Bond EP17HT-LO is a one part epoxy for bonding, sealing, coating and encapsulation applications. This low viscosity system has very low exotherm upon curing and can be cast in sections up to and beyond a ½ inch in thickness.
Formulated for die attach applications, Master Bond Supreme 3HTND-2DA is a fast curing, high performance one component epoxy system. It cures in 5-10 minutes at 150°C and has unlimited working life at room temperature. It is available in syringes and has a shelf life of 6 months when stored at 40-50°F.
Master Bond Supreme 12AOHT-LO is a one component epoxy for a variety of bonding and sealing applications in the aerospace, electronic, electro-optic and OEM industries. This system fully passes ASTM E595 testing for NASA low outgassing and is well suited for vacuum environments.