The Latest Developments from the Master Bond Labs...

New Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved

Developed for rigorous bonding and sealing in demanding manufacturing applications, Master Bond EP3HTSMed epoxy system features a rapid cure schedule and a tensile shear strength exceeding 1,000 psi. It is 100% reactive and fully meets USP Class VI requirements for medical applications.

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High Performance, UV Curable Epoxy with Enhanced Chemical Resistance

Combining superior physical strength and fast cure rates, Master Bond UV16 is formulated for demanding bonding, sealing, and coating applications. It is a one component, no mix system and cures in one minute or less at room temperature with commercial UV light sources.

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Medical Grade Epoxy Adhesive Withstands High Temperatures and Repeated Sterilization

Capable of tolerating the harsh environments of the medical industry, Master Bond EP42HT-2ND2Med Black fully complies with the testing requirements of USP Class VI plastics. This two component epoxy resists recurrent autoclaving and sterilizations including radiation, steam, ethylene oxide, and chemical sterilants.

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Silver Conductive Epoxy Meets NASA Low Outgassing Standards

Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries.

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Low Viscosity, Room Temperature Curing Epoxy Complies With FDA and USP Class VI Requirements

Ideal for potting and encapsulation applications, Master Bond EP21LV features a low viscosity and outstanding electrical insulation properties. It is broadly used in the medical and food industries, as it conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements.

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New, Versatile Food Grade Epoxy Resists High Temperatures & Harsh Conditions Tested and Certified to Meet FDA CFR 175.300

Master Bond is pleased to announce the release of EP42HT-2FG, a new food grade epoxy system. EP42HT-2FG has been independently tested and certified by a leading national laboratory to meet the stringent requirements of FDA CFR 175.300. It also was toxicologically evaluated to meet the NSF/ANSI 51.4.1 (2009) standard for food equipment materials.

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LATEST PRODUCT

New Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved

Developed for rigorous bonding and sealing in demanding manufacturing applications, Master Bond...

Read more

LATEST WHITE PAPER

Thermally Conductive Adhesives Keep Things Cool

Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of...

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