Master Bond EP113 is a nanosilica filled epoxy that delivers enhanced dimensional stability and exceptionally low shrinkage upon curing. This optically clear, two component system is well suited for applications in the aerospace, electronic and OEM industries.
Master Bond MasterSil 910Med is a one part acetoxy type silicone system that meets USP Class VI specifications for biocompatibility and ISO 10993-5 testing for cytotoxicity. This translucent paste also withstands many sterilization methods, including liquid sterilants, gamma radiation and EtO.
Featuring a silicon carbide filler, Master Bond Supreme 45HTQ-4 is a toughened epoxy for high performance bonding, sealing, coating and casting. This specialty system can be used for a wide variety of special industrial, aerospace, OEM and oil processing applications, especially in downhole situations.
Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature.
Master Bond UV15X-6NM-2 is a one component UV curing urethane acrylate system formulated for a variety of bonding, sealing, coating and encapsulation applications. This moderate viscosity product features flexibility, toughness and abrasion resistance. It is widely used for fiber-optic, optical, electronic, semiconductor, microelectronic and laser applications.
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m·K)].