The Latest Developments from the Master Bond Labs...

Formulated to operate over the wide temperature range of -80°F to +650°F, Master Bond EP17HT-LO is a one part epoxy for bonding, sealing, coating and encapsulation applications. This low viscosity system has very low exotherm upon curing and can be cast in sections up to and beyond a ½ inch in thickness.

Formulated for die attach applications, Master Bond Supreme 3HTND-2DA is a fast curing, high performance one component epoxy system. It cures in 5-10 minutes at 150°C and has unlimited working life at room temperature. It is available in syringes and has a shelf life of 6 months when stored at 40-50°F.

Master Bond Supreme 12AOHT-LO is a one component epoxy for a variety of bonding and sealing applications in the aerospace, electronic, electro-optic and OEM industries. This system fully passes ASTM E595 testing for NASA low outgassing and is well suited for vacuum environments.

With biocompatibility and cytotoxicity certifications, Master Bond EP21AOLV-2Med is often selected for bonding, sealing, coating and encapsulation applications in the medical device industry. This two component epoxy system withstands a variety of sterilization methods, including EtO, radiation and many cold sterilants.

Master Bond MB250NT is widely used for a variety of applications ranging from repair to high speed production for disposable/reusable medical devices and passes ISO 10993-5 testing requirements. It also resists EtO and gamma sterilization processes.

Suitable for a variety of applications in the electronic, aerospace and OEM industries, Master Bond EP3SP5FL is a single component epoxy that cures in 1-2 minutes at 300°F. Since it requires heat curing, it essentially has “unlimited” working life at room temperature.

Pages

LATEST PRODUCT

Formulated to operate over the wide temperature range of -80°F to +650°F, Master Bond EP17HT-LO is a...

LATEST WHITE PAPER

Potting compounds offer superior protection for electronic circuits potting and encapsulation compounds are designed to...