Specially developed adhesives, sealants, conformal coatings and encapsulation compounds have been formulated for the assembly of medical electronic devices. These products consist of one and two component epoxy systems, one and two part silicone compounds and UV curable formulations. These technologically advanced materials offer high reliability and easy processing.
Types of Compounds for the Assembly of Medical Devices
Medical electronic devices have greatly enhanced the ability to diagnose, treat and monitor different medical conditions. Master Bond offers the following products to meet these critical needs:
- Electrically conductive pastes
- Electrically insulative pastes
- Thermally conductive/electrically insulative pastes
- Glob top coatings
- Conformal coatings
- Underfill encapsulants
Specific grades feature:
- Low stress
- Low outgassing
- Snap cures
- Ultra low moisture absorption
- Optical clarity
Applications for Master Bond Medical Electronic Device Compounds
Master Bond formulations are employed in a wide range of medical electronic device applications including:
- Hearing aids
- Drug releasing pumps
- Fetal and maternal monitors
- Fingertip pulse oximeters
Some of Our Most Popular Medical Electronic Device Compounds
Epoxy-urethane blend. Superior toughness and abrasion resistance. Biocompatible. Cryogenically serviceable. Low viscosity. Low moisture absorption and hydrolytic stability. USP Class VI approved. Serviceable from 4k to +250°F. Outstanding electrical insulation properties. Withstands thermal cycling. High impact strength.
Silver conductive epoxy with low volume resistivity and USP Class VI certification. Cures at room temperature or more quickly at elevated temperatures. Durable. Serviceable from 4k to +250°F. Smooth paste. One to one mix ratio by weight or volume. Shore D hardness 50-60. High bond strength.
Medical grade, USP Class VI approved silicone. Addition type cure system. Optically clear. Low outgassing. Offers ambient or elevated temperature cures. Excellent for potting and encapsulation applications. Low shrinkage upon cure. Resists gamma radiation, EtO and various chemical sterilants. Serviceable from -65°F to +400°F.
Two component epoxy paste adhesive. Resists sterilization exposure. USP Class VI approved. Outstanding thermal stability and electrical insulation properties. Cures at ambient temperatures. Withstands multiple cycles of autoclaving, radiation, EtO and chemical sterilants. Post curing is recommended to optimize physical properties. Serviceable from -60°F to +450°F.
One part, silver conductive epoxy adhesive. USP Class VI approved. Rapid cures at elevated temperatures. Thixotropic paste. Serviceable from -60°F to +400°F. High shear strength. Excellent thermal and electrical conductivity. Exceptionally low resistivity.