Master Bond one and two component, heat curable epoxies, silicones, polyurethanes and polysulfides feature outstanding performance and reliability. They offer excellent adhesion to similar and dissimilar substrates and can withstand exposure to a wide range of chemicals.
Benefits of Heat Curable Systems
Master Bond heat curable systems are employed in the aerospace, automotive, electronic, optical, medical, renewable energy and other industries. Specific grades offer:
- High and low temperature serviceability
- Resistance to vibration and shock
- Optical clarity
- Fast cures
- Superior electrical insulation properties
Special grades are also certified to meet the following requirements:
- NASA low outgassing
- USP Class VI for biocompatibility
- UL 94V-0 for flame retardancy
- Halogen free
Performance Properties for Heat Curable Adhesives
As with all products in the Master Bond family, specific grades can also vary in viscosity, cure speed, chemical resistance, electrical properties and can be custom formulated to fit your application needs.
Some of Our Most Popular Heat Curing Systems
Two part toughened epoxy system. Capable of continuous service at 500°F. 100% reactive. Unmatched durability. Outstanding chemical resistance. Robust physical strength profile. Dimensionally stable. Machineable. Withstands rigorous thermal cycling. Service operating temperature range from -80°F to +500°F.
Rapid curing, one part epoxy. Meets USP Class VI biocompatibility standards. Thixotropic paste viscosity. High shear strength. Superb resistance to autoclaving, chemical sterilants, radition, EtO. Serviceable from -60°F to +400°F.
One component, fast heat curing system. Can withstand rigorous thermal cycling. Thermally conductive, electrically insulative. Thixotropic paste viscosity. Serviceable up to 350°F.
One part, no mix epoxy meets NASA low outgassing specifications. Serviceable up to 650°F. Tg is 225°C. High shear, tensile and compressive strength properties. Cures in 90-120 minutes at 300F. Withstands 1000 hours 85°C/85% RH.
Fast cures at ambient 175°F (80°C). Recommended for bonding heat sensitive substrates. Outstanding thermal cycling capabilities. Single part no mix system. Serviceable from -100°F to +350°F. Tough and durable. Withstands 1,000 hours at 85°C/85% RH.
Cures rapidly at moderate elevated temperatures. Superior resistance to moisture. Two part epoxy has long pot life at ambient temperatures. High bond strength properties. Reliable electrical insulator. Serviceable from -60°F to +450°F. Withstands aggressive chemical exposure. Tg 160-165°C. Shore D hardnes >80.