Epoxy Adhesive Films & Preforms
Master Bond’s electronic grade adhesive films and preforms feature noteworthy characteristics including storage stability at ambient temperatures, fast cures, high bond strength and excellent chemical resistance.
Performance Properties of Master Bond Adhesive Films and Preforms
Grades of our epoxy films and performs can be adjusted to meet specific requirements of:
- Electrical/thermal properties
- Temperature & chemical resistance
Successful industry applications include:
- Substrate attachment with minimal squeeze out
- Heat sink bonding
- Lid sealing
- Stress absorption
- Connectors and other electronic assemblies
Popular Master Bond Film & Preform Adhesive Systems
- B-staged film adhesive/sealant. Outstanding thermal cycling capabilities and structural properties. Offers superior toughness and flexibility. Excellent strength retention at elevated temperatures.
- High performance, silver filled epoxy adhesive film system with outstanding electrical and thermal conductivity, superior mechanical strength, convenient handling, good storage stability and fast cures at moderate temperatures.
- High performance, thermally conductive, electrically insulative, resin based epoxy adhesive film system. Offers superior mechanical strength, convenient handling, good storage stability and fast cures at moderate temperatures.