Impregnation Applications

Epoxy Impregnation Compounds for Advanced ApplicationsSingle part, no mix, epoxy impregnation compounds are used to seal porosity in metals and non-metals. These low viscosity systems cure at elevated temperatures to a tough, strong chemical resistant thermoset plastic.

Advantages of Master Bond Impregnation Resins

Master Bond impregnation compounds feature long-term storage stability, exceptional chemical resistance and the ability to withstand elevated temperatures. Additionally, they are:

  • 100% reactive
  • Easy to process
  • Non-hydroscopic
  • Fast curing at +250°F

Most Popular Epoxy for Impregnation Applications

EP19HT
One component, storage stable epoxy resin system. Viscosity 500-600 cps. Tensile strength over 10,000 psi. Excellent chemical resistance. Thermal stability up to +400°F. Superb electrical insulation properties.

LATEST PRODUCT

Master Bond EP30HV, a two component epoxy, features wide applicability in the electronic, electrical,...

LATEST WHITE PAPER

Potting compounds play a vital role in the assembly and long term protection of delicate electronic components. The...