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Curing Properties

Curing Processes of Master Bond EpoxiesMaster Bond adhesives, sealants and coatings offer a variety of different curing processes, designed for easy processing and high reliability. Types of processes vary in cure speed, section thickness capabilities and preparation requirements. They include:

Master Bond can custom formulate a product with a specific curing technique in order to maximize the efficiency of any individual application.

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Formulated to operate over the wide temperature range of -80°F to +650°F, Master Bond EP17HT-LO is a...

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Potting compounds offer superior protection for electronic circuits potting and encapsulation compounds are designed to...