Adhesives, Sealants and Coatings for Semiconductor AssembliesMaster Bond is leading the way in semiconductor packaging with a complete line of underfill, die attach, glob top and encapsulation compounds. These systems are designed for easy processing and dependability.

Applications of Master Bond’s Semiconductor Adhesives

Our epoxy systems can be applied in many different semiconductor applications, such as:

  • Passive components
  • Discrete components
  • BGA/CSP
  • QFN
  • SOIC/SOP
  • Flash/DRAM
  • Optics

Learn more about adhesives for chip stacking applications

Properties of Master Bond Epoxy Systems for Semiconductor Applications

Select grades offer exceptional mechanical, electrical, thermal and optical properties, including:

  • Thermal conductivity
  • Electrical insulation
  • Snap cures
  • B-stage
  • Low outgassing
  • Ultra low moisture absorption
  • Low coefficient of thermal expansion (CTE)
  • Stress absorption
  • Serviceability in extreme temperatures

Most Popular Adhesives for the Semiconductor Industry

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