Lid Sealing of Electronic PackagesElectrically insulative epoxy paste and B-staged preform adhesives provide cost effective alternatives to seam welding, soldering or glass attachment in lid sealing applications. They also offer low temperature processing and avoidance of metal particle contamination. These compounds feature high bond strength, thermal stability and superior protection against moisture. Preform systems cure rapidly at moderate elevated temperatures, have controllable flow and long storage stability.

Most Popular Lid Sealing Epoxies

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