One and two component epoxy compounds have been developed for aerospace bonding, potting, filling and repair applications. These high performance compositions are available for use in low and high viscosities. Specific grades meet NASA low outgassing specifications and comply with UL 94V-0 flame retardancy requirements.
Benefits of Structural Toughened Paste Adhesives for Aerospace Applications
- High bond strength to similar and dissimilar substrates including composites, aluminum, stainless steel and titanium
- Resistance to cyclic fatigue
- High peel strength
- Superior durability and toughness
- Exceptional compressive strength
- Fast set systems
- Custom packaging
- High glass transition temperatures
- Automatable application
Master Bond offers specialized packaging for aerospace applications, including premeasured kits and convenient gun applicators.
Most Popular Toughened Structural Adhesives
Two component, toughened epoxy adhesive. High peel strength and shock resistant. NASA low outgassing certified. Convenient one to one mix ratio. Ideal for bonding similar and dissimilar substrates. Withstands 1,000 hours 85°C/85% RH. Serviceable from -100°F to +350°F. Good flow. Easy to apply.
Thermally conductive and electrically insulative, one part epoxy adhesive. Superior toughness and dimensional stability. Bonds are resistant to thermal cycling and many chemicals. Serviceable from 4K to +400°F. NASA low outgassing approved. Withstands 1,000 hours 85°C/85% RH. Impressive physical strength properties.
Resists prolonged service above 500°F. Exceptional durability and flexural strength. High adhesion to metallic and non-metallic substrates. Heat curable system. Tg +240°C. Special two part epoxy with very long working life. Excellent compressive strength. Service operating temperature range from -80°F to +600°F.
NASA low outgassing approved B-stage epoxy adhesive. Tough and flexible. Elongatio >50%. Thermally conductive/electrically insulative. Withstands rigorous thermal cycling. Can be die cut into custom shapes. Squeeze out is minimal. Ideal for applications requiring precise bond lines. Resists up to +500°F.
Highly flexibilized, thermally conductive/electrically insulative epoxy adhesive. High elongation. Exhibits superior shear and peel strength properties. Serviceable from 4K to 250°F. Withstands thermal cycling, thermal shock and mechanical shock. Passes NASA low outgassing test. Cures at room temperature or more quickly at elevated temperatures.