Low Outgassing Adhesive Formulations
USP Class IV ApprovedMaster Bond has developed a line of specialty adhesives that have passed NASA low outgassing specifications and exceed the ASTM E595 test requirements. These products are successfully employed in applications ranging from disk drives and flat panel displays to advanced avionics and aerospace components.

Master Bond's low outgassing compounds demonstrate outstanding performance and select grades are serviceable over the exceptionally wide temperature range of 4K to +200°C. They are designed to prevent contamination that can reduce device functionality. Optical products can be clouded/fogged by outgassed chemical compounds. Electronic/semiconductor processing can be sensitive to outgassing materials. Vacuum processing can also be adversely affected by use of non compliant adhesives.

Performance Properties for Master Bond's Low Outgassing Adhesives

Master Bond’s line of high purity low outgassing systems meet stringent performance requirements for challenging applications. Among the most important features are:

  • Electrical conductivity
  • Thermal conductivity
  • High and low temperature resistance
  • Dimensional stability
  • Low shrinkage
  • Optical clarity
  • Vacuum compatibility

Low Outgassing Systems

Most Popular Low Outgassing Epoxy and Silicone Systems

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