One and two component advanced epoxy systems have been developed for joining dissimilar substrates exposed to thermal/mechanically induced stresses. These dimensionally stable, low shrinkage compounds which are formulated with select fillers offer extra low coefficients of thermal expansion. Products provide the integrity of bonded joints even from high/low temperature exposure. Grades consist of electrically insulative and thermally conductive/electrically isolating systems. They are available for use in a variety of viscosities. NASA low outgassing approved systems meet ASTM E595 requirements for critical aerospace, optical, electronic and specialty OEM needs. Select products have been employed as thermal interface materials to optimize heat transfer and improve device reliability.
Most Popular Low Coefficient of Thermal Expansion Epoxies
- Two component thixotropic paste. Cures at ambient temperatures. NASA low outgassing certified system. Serviceable from 4K to 400°F. Thermally conductive/electrically insulative. Coefficient of thermal expansion, 75°F is 18-21 x 10-6/in/in/°C.
- For bonding, sealing, coating, encapsulation. Superior thermal conductivity and electrical insulation properties. Passes NASA low outgassing tests. Cryogenically serviceable. Low thermal expansion coefficient of 15-18 x 10-6/in/in/°C.
- One component heat curing epoxy. Thermal stability +500F. Easy to apply. Electrically insulative. Superior chemical resistant properties. Paste consistency and will not flow when curing. Coefficient of thermal expansion 25-30 x 10-6/in/in/°C.
- Ultra low coefficient of thermal expansion of 9-12 x 10-6/in/in/°C. Shore D hardnes >85. Two component room cure system. Low shrinkage and superior dimensional stability. Volume resistivity >1014ohm cm. Excellent chemical resistance. Serviceable from -60°F to +300°F.