One and two component thermally conductive epoxy and silicone compounds are employed for bonding heat sinks to electronics components and circuit boards to dissipate heat. These highly effective thermal interface materials contain special alumina, boron nitride, silica, aluminum nitride fillers or particles to imprive device reliability and longevity. They are designed to help prevent overheating and premature component failure. Adhesion to ceramic, composite, plastic, metal surfaces such as aluminum and copper are excellent.
Products are engineered to fill in gaps that impede the flow of heat. Room temperature and heat curing systems can be manually or automatically dispensed. Typical heat sink bonding applications include:
- Electric vehicles
- Gaming systems
- Mobile phones
- Memory devices
Special Performance Properties of Heat Sink Adhesives
As electronic devices and components become smaller, faster, increase functionality, consume more power, the efficent transfer of heat becomes more vital. Master Bond has developed heat sink adhesives with higher thermal conductivity values to meet these challenging evolving requirements. These solvent free, ROHS compliant compounds are available for use in a range of viscosities, hardnesses, cure speeds and
- Superior gap filling capabilities
- Enhanced shock, impact and vibration resistance
- Exceptional electrical insulation properties
- Thermal stability
- Excellent mechanical strength
It is important to note that in addition to the thermal interface material careful consideration needs to be given to heat sink width, length, fin density, fin spacing, airflow to ensure optimizing heat dissipation capabilities.
Master Bond adhesive systems eliminate the need for mechanical fasteners such as screws, clips, clamps, rivets, push pins for heat sink attachment. Select grades are NASA low outgassing approved, withstand 1,000 hours 85°C/85%RH and have fast fixturing speed to increase productivity. Stress absorbing elastomeric formulations are ideal for bonding surfaces with different CTEs. Special compositions are reworkable.
Most significantly Master Bond has pioneered the development of epoxy compounds that can be applied in bond lines as thin as 10-15 microns and have ultra low thermal resistance.
One and Two Component Systems for Heat Sink Attachment
single component epoxy adhesive features unmatched heat transfer properties. Capable of being applied in bond lines as thin as 10-15 microns. Low coefficient of thermal expansion. Meets NASA low outgassing specifications. Low shrinkage upon curing Operating temperature is 4k to +400°F.
Thermally conductive/electrically insulative epoxy. Two part system cures at ambient temperatures. Has convenient one to one mix ratio by weight or volume. Excellent heat transfer characteristics. High bond strength. Shore D hardness 85-90. Low coefficient of expansion. Serviceable from -60°F to +250°F.
Two component epoxy adhesive features thermal stability and heat dissipation properties. Superb electrical insulator. High compressive strength. Excellent dimensional stability. Resists -60°F to +400°F. Non-critical one to one mix ratio by weight or volume. Gap filling system.
Thermally conductive and electrically isolating. Easy to use silicone for high performance bonding, sealing and coating. Non-corrosive and room temperature curable. Ideally suited for applications requiring flexibility and high temperature resistance.
One part, oven cured epoxy system with excellent thermal conductivity and superb resistance to thermal cycling. Primarily used for bonding of heat sinks and sensors where heat transfer is desirable. Halogen free. Serviceable from 4k to +400°F. Convenient processing.