Underfill Encapsulants for Advance ApplicationsDesigned to improve reliability, Master Bond’s line of epoxy underfill compositions offer excellent underfill to die passivation as well as outstanding adhesion to a variety of substrates. They improve mechanical support, lower strain on solder joints and provide superior protection from moisture.

Applications for Epoxy Underfill Encapsulants

  • Flip chip devices
  • Ball grid arrays
  • Chip scale packaging

Advantages of Master Bond Underfill Systems

Both flowable and non-flow systems are available for use. Additionally, to improve efficiency of production snap cure and reworkable systems have been introduced. The key properties of theses systems include:

  • High purity
  • Low stress
  • High adhesion
  • Low coefficient of thermal expansion (CTE)
  • Low outgassing
  • High glass transition temperature (Tg)
  • High Young’s modulus
  • Moisture resistance
  • Short cure cycle
  • Structural stability
  • Thermal cycling resistance
  • Shock and vibration resistance

Our Most Popular Flip Chip Underfill Systems

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