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Adhesives for the Assembly of Electronic Devices

Adhesives for the Assembly of Electronic DevicesFormulations are available to meet the evolving needs of the electronic industry. Specific grades are available for:

Products include:

Master Bond Electronic Grade Epoxies Feature Exceptional Performance Properties

Products are easy to apply and available for use in convenient applicators (including premixed and frozen syringes for two component epoxy systems). Properties of specific grades include:

  • High bond strength to similar and dissimilar substrates
  • Low stress
  • High/low temperature serviceability
  • Fast cures
  • Resistance to water and many chemicals
  • Low coefficient of thermal expansion

 

International Microelectronics and Packaging Society Member LogoMaster Bond is a member of the International Microelectronics and Packaging Society.

Microelectronics Packaging & Test Engineering Council LogoMaster Bond is a member of MEPTEC: Microelectronics Packaging & Test Engineering Council.

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Formulated to operate over the wide temperature range of -80°F to +650°F, Master Bond EP17HT-LO is a...

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Potting compounds offer superior protection for electronic circuits potting and encapsulation compounds are designed to...