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Adhesives for the Assembly of Electronic Devices
Formulations are available to meet the evolving needs of the electronic industry. Specific grades are available for:
- Conformal Coatings
- Die Attach Adhesives
- Glob Tops
- Lid Sealing
- Surface Mount Adhesives
- Underfill Encapsulants
Master Bond Electronic Grade Epoxies Feature Exceptional Performance Properties
Products are easy to apply and available for use in convenient applicators (including premixed and frozen syringes for two component epoxy systems). Properties of specific grades include:
- High bond strength to similar and dissimilar substrates
- Low stress
- High/low temperature serviceability
- Fast cures
- Resistance to water and many chemicals
- Low coefficient of thermal expansion
Master Bond is a member of the International Microelectronics and Packaging Society.
Master Bond is a member of MEPTEC: Microelectronics Packaging & Test Engineering Council.
Master Bond is a member of the Surface Mount Technology Association.