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Thermal Properties of Adhesive Systems

Thermal Properties of Master Bond Adhesive SystemsMaster Bond offers a number of adhesives, sealants and coatings with exceptional thermal properties. Our product line features the following properties:

 

Applications of Polymer Compounds with Advanced Thermal Properties

Master Bond adhesives withstand temperatures as low as 4K and as high as 600°F. They can be used in almost any application that requires resistance to extreme temperatures. Our adhesive systems differ in temperature resistance, thermal cycling resistance, viscosity, flexibility, cure times and other properties. For unusual requirements, we can custom formulate a product that meets your individual design needs.

LATEST PRODUCT

Formulated to operate over the wide temperature range of -80°F to +650°F, Master Bond EP17HT-LO is a...

LATEST WHITE PAPER

Potting compounds offer superior protection for electronic circuits potting and encapsulation compounds are designed to...