Master Bond Polymer System EP21LV 3/5 is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at room temperature and more quickly at elevated temperatures. It has a forgiving 3 to 5 mix ratio by weight or volume. The EP21LV 3/5 produces tough, high strength, durable bonds which hold up very well to thermal cycling and resist many chemicals including cold sterilants, water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -80°F to +250°F. It bonds well to a wide variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21LV 3/5 is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. As a Class VI epoxy, EP21LV 3/5 is truly unique in that it cures flexible allowing it to be used in a wide range of applications where more rigid epoxies are not suitable. In addition, it meets FDA requirements for food compatibility. EP21LV 3/5 contains no solvents or diluents. The color of the cured material is amber-clear.