
EP21TP-2 Product Description
Two Component Polysulfide/Epoxy Adhesive/Sealant for High Performance Bonding and Sealing
Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 1 to 1 mix ratio (A/B) by weight or volume. It readily develops a high bonding strength of more than 1,000 psi at room temperature which, unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Adhesive EP21TP-2 can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough flexible bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -80°F to 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive/sealant is an electrical insulator. Color of part A is tan, part B is amber. Master Bond EP21TP-2 adhesive/sealant is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.
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- Polysulfide |
- Heat Cure |
- Room Temperature Cure |
- Non-Drip |
- Electrically Insulative |
- Thermal Cycling Resistant |

