The fast growing pace of miniaturation of microelectronic devices has emphasized the need for materials capable of precise dispensing, positioning and bonding specialized components on printed circuit boards as well as other advanced electronic devices. Master Bond has successfully developed a line of unique epoxy formulations which can be accurately dispensed, positioned and bonded to microelectronic components on printed circuit boards and many other assemblies.

• UV & heat curable systems
• Easy application
• Fast cure speeds
• Low stress
• Low shrinkage
• Low outgassing
• Exceptional thermal conductivity
• High physical strength properties
• Superior electrical insulative properties
• Protects against humidity, high temperature & chemicals

Contact our world class technical staff today, and let us recommend a Master Bond product specifically for your application.

Master Bond has developed a new family of one component high performance epoxy compounds to meet the fast growing demand for precise positioning, bonding and encapsulation of microelectronic components on printed circuit boards and other advanced electronic devices. These unique epoxy formulations feature special rheological properties which make practical, customized flow properties for easy dispensing, exact positioning and supreme bonding and encapsulation of microelectronic components and other devices on fiber reinforced circuit boards as well as ceramic and/or metallic substrates. They are readily cured in as little as 15-25 minutes at 250°F or only 5-10 minutes at 300°F. Also available is a UV curable formulation, which cures at ambient temperatures within 30-60 seconds. Special formulations are available for in-line production.

The newly designed Master Bond epoxy glob top components feature excellent long term environmental protection and outstanding resistance against thermal cycling as well as severe mechanical shock and vibration. Dimensional stability properties are truly remarkable. Both thermally conductive electrically insulating as well as straight electrically insulating materials (no thermal conductivity) are available. The advanced technology employed for formulating these new compositions is such that they exhibited shelf lives of 6 months at ambient temperatures without the need for refrigeration in storage.

The fast growing pace of miniaturization of microelectronic devices has emphasized the need for materials capable of precise dispensing, positioning and bonding specialized components on printed circuit boards as well as other advanced electronic devices. Master Bond has successfully developed Supreme 3HT-2GT, a unique one-component epoxy formulation which can be accurately dispensed, positioned and bonded to microelectronic components on printed circuit boards and many other assemblies. This one-component epoxy system cures at 250°F within only 15-25 minutes or at 300°F in as little as 5-10 minutes. It exhibits high physical strength properties and excellent adhesion to a great number of nonmetallic as well as metallic substrates ranging from silicon chips to PCB's, heat sinks and ceramics. This truly unique composition likewise has superior electrical insulation properties, resistance to thermal shock and vibration and outstanding chemical resistance to water, acids, bases and many aggressive organic solvents.

Most importantly, Master Bond Supreme 3HT-2GT has a long storage life of six months at ambient temperatures and does not have to be refrigerated. It can be readily and accurately dispensed by a single syringe and can also be applied by printing technologies. Master Bond Supreme 3HT-2GT has a remarkably wide service temperature range from -100°F to as high as 400°F.

• Chip On Board Assembly
• Micro Machined Integrated Antenna
• LTCC Carriers
• Integrated Circuits
• Transistors
• Flexible Printed Circuits
• Rigid Printed Circuits
• Smart Cards
• Diodes