 
Experts In Solving Problems
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Master
Bond's technical team has over 30 years of experience
and understands the unique needs of each and every
application. We provide personal “one-on-one” assistance
and can recommend a compound tailor-made to meet your
requirements. Put our expertise to work for you. Contact
us today. |
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Use Master Bond Flexibilized & Toughened Adhesives, Sealants, Coatings, and Potting & Encapsulation Compounds For Improved Durability
Master Bond Inc. has developed the widest variety of flexibilized and
toughened epoxies, silicones, polyurethanes, polysulfides and
UV cures for special application requirements. These compounds
offer high peel/shear strength, enhanced resistance to vibration,
impact, shock and thermal cycling and serviceability at low/cryogenic
to high temperatures. Adhesion to dissimilar substrates is
outstanding.
These formulations vary in viscosity, cure times, electrical properties, colors, temperature and chemical resistance. Both one and two component systems are available for use. Specific grades offer:
 Electrical and Thermal Conductivity- NASA Low Outgassing Approval
- Superior Electrical Insulation Properties
- Outstanding Water and Chemical Resistance
- Cryogenic Serviceability
- Optical Clarity
- Easy Repairability
- Low Stress
- Adjustable Volume Resistivity
- Low Shrinkage
- High Dielectric Strength
- Low Dielectric Constant
- Gap-Filling
- High Temperature Resistance
Contact our world class technical staff today,
and let us recommend a Master Bond product specifically for
your application.
Our Most Popular Flexibilized & Toughened Systems...
| Product |
Description |
EP21TDC-7 |
Highly flexible two part room temperature
curing systemwith outstanding adhesion to most rubbers.
Shore D hardness of 30-35. High peel strength of 40pli
@ 75°F and an
elongation of >400% ast 75°F. |
EP21TPLV |
Two part, room temperature curing
polysulfide for bonding, coating, sealing and casting.
Exceptionally tough. Service temperature range of -80°F
to 250°F. One to one mix ratio. Shore D hardness
of 35/40. |
SUPREME 10HT |
One part, no-mix, heat cured epoxy
system with high toughness. Outstanding
heat and thermal cycling resistance. High peel and
shear strength. Service operating temperature range of
4K to 400°F. |
High Reliability & Performance
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Master Bond's flexibilized and
toughened systems are designed to offer superior quality and long
term durability. They have earned a well deserved reputation for
their performance upon exposure to hostile environmental conditions.
Select from a wide range of systems conveniently packaged for ease
of use. These compounds are available in different viscosities,
cure times, chemical resistances, electrical properties, colors,
etc. to best meet specific requirements. They are presently
employed in applications ranging from design and production
to repair, maintenance and field service.
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Packaged the Way You Need
It
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We offer a wide array of packaging
options to speed productivity, minimize waste and save energy
including...
• Quantities from grams to gallons
• Cans, bottles
and jars
• Cartridges for manual and pneumatic guns
• Premixed and frozen
syringes
• Bipaks for field service kits
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Master Bond Flexibilized & Toughened Systems
are
Used in a Wide Range of Applications
 For the bonding and sealing of a variety of substrates which exhibit different coefficients of thermal expansion- Impact and vibration resistance
- General purpose thermal cycling
- Boroscopes and doublets
- Thermistors
- Various gasketing applications
- A low modulus, low stress seal
- Attaching guide wires and catheter balloon bonding
- Protection of CSPs from mechanical shock and vibration
- For use in select spacecraft electronic applications
- In vacuum impregnation where rigid epoxy would be inappropriate
- For the bonding of delicate parts or parts where stress may be encountered
- Excellent adhesion to many metal, plastic, glass, and rubber substrates.
- For the bonding, sealing, and potting of sensitive optical components
- For encapsulating intricate electrical and electronic components
- For the encapsulation of heat-generating devices and modules
- For bonding of stress sensitive devices.
- Piezoelectric and micro-machined sensors
- Sound dampening
- To provide low stress on surface mount components
- For assembly of flexible circuits
- Solder replacement in select situations
- Assembling heating elements
- For attaching heat sinks to electrical components
- For the potting of transformers and inductors
- Bonding flexible substrates and connectors
- Encapsulating coils, potentiometers and modules
- Cable joints/terminations
- Optoelectronic transceiver modules
- Bonding of semiconductor, capacitor, and resistor chips
in micro and optoelectronic hybrid circuit fabrication
- To mold and cast cable connectors, harness assemblies, wiring, and other elastic components
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