Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It readily develops a high bonding strength of more than 1500 psi tensile shear. The volume resistivity of the cured system is 50 to 100 ohm-cm. Since EP75-1 is graphite filled, the system also features nonmagnetic properties as well as high lubricity. EP75-1 contains no solvents or diluents.

Master Bond Polymer System EP75-1 can be applied with minimal sagging or dripping even on vertical surfaces, although it can be made thinner by adding 5 to 10% by weight of an appropriate solvent such as xylene, acetone or MEK. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oils, acids and bases. The temperature range is -60°F to +250°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Master Bond EP75-1 adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance and automotive industries, among others. It is particularly useful in applications where the conductive adhesive should not have any magnetic properties or in applications where good lubricity is needed.