EP62-1HTMed Product Information

Two Component Epoxy EP62-1HTMed

Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures and Sterilization Resistance, Passes 10993-5 for Cytotoxicity

EP4S-80 Product Description

One Part, Silver Filled Epoxy

One component epoxy for bonding, sealing and coating applications, curing temperature 80°C. Electrically conductive, NASA low outgassing.

EP40TC Product Information

Two Part Epoxy EP40TC

Two Component, Flexible, Moderate Viscosity Epoxy Compound With Outstanding Shear and Peel Strength For Bonding And Sealing. High strength structural bonding. NASA low outgassing.

EP29LPSPND-3 Product Information

Two Part Epoxy System EP29LPSPND-3

Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock with a paste consistency.

EP17HTDA-2 Product Information

One Part Die Attach Epoxy EP17HTDA-2

One component die attach epoxy system with exceptionally high glass transition temperature. Resists temperatures up to +600°F. Thermally conductive, electrically insulating, Paste consistency.

EP5G-80 Product Description

EP5G-80 One Component Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally and electrically conductive, high compressive strength. Meets NASA low outgassing specifications. Non-metallic, graphite filler.

Supreme 11HTLV Product Information

Supreme 11HTLV Two Component Epoxy

Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -100°F to +350°F Featuring High Peel and High Shear Strength

Supreme 11LV Product Information

Two Part Epoxy Supreme 11LV

Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -100°F to +250°F Featuring High Peel and High Shear Strength

EP4TC-80 Product Description

EP4TC-80 One Part Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength.

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