Two Component, Moderate Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Encapsulation Featuring Very Low Exotherm and a Long Working Life.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties,
Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
One Component, No Mix, Low Viscosity System Featuring High Reaching Thermal Stability, Resolute Electrical Insulation Properties and Excellent Thermal Shock Resistance for Bonding, Sealing, Coating, Encapsulation and Impregnation Applications.
Two Component, Toughened, Quartz Filled, Heat Resistant Epoxy Compound for High Performance Bonding, Sealing and Casting Well Suited for Resisting a Wide Variety of Chemicals at Higher Temperatures.
Two Component, Room Temperature Curable, Epoxy Adhesive, Sealant, Coating and Gap Filling System Featuring High Temperature and Chemical Resistance. Thixotropic Consistency.
B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation. Magnificent Structural Adhesive Properties and Exceptional Thermal Cycling Capabilities.
Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Thermal Cycling Capabilities, Excellent Thermal Conductivity Along With Exceptional Electrical Insulation Properties.
