Thermal Cycling Resistant

MasterSil 930 Product Information

One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.

EP19HTFLSP-1 Product Information

One Component, Flexibilized Epoxy Resin System For Durable High Performance Adhesive/Sealants, Impregnants and Liners, with Good Storage Stability

EP21HTND Product Information

Two Component, Room Temperature Curing Adhesive, Sealant & Coating Featuring Convenient 1:1 Mix Ratio and High Temperature Serviceability Up To 400°F Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications

EP21HTFG Product Information

Two Component, Room Temperature Curing Adhesive, Sealant & Coating Featuring Convenient 1:1 Mix Ratio and High Temperature Serviceability Up To 400°F Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications

EP21TDCHTND Product Information

Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance.

MasterSil 910Med Product Information

One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.

MasterSil 971-LO Product Information

One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.

MasterSil 970-LO Product Information

One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.

EP21AOND Product Information

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulating Featuring a Convenient and Forgiving 1:1 Mix Ratio.

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Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a...

LATEST WHITE PAPER

Dielectric constant, dissipation factor, dielectric strength, surface and volume resistivity are all fundamental...