B-staged film for high performance bonding and sealing, NASA low outgassing approved
Two component epoxy for potting, bonding, sealing and coating
One component “snap cure” epoxy adhesive
One component, thermally conductive epoxy adhesive
Two part, thermally conductive, electrically insulative epoxy for bonding and sealing featuring outstanding heat resistance; requires oven curing
Two component, condensation curing silicone for potting, encapsulation and sealing
Toughened, two component epoxy for bonding, sealing and coating
Two component, highly flexibilized epoxy for bonding, sealing and coating
One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Thoroughly Non-Drip Formulation.
Two component epoxy compound for high performance applications
Master Bond MB250NT is widely used for a variety of applications ranging from repair to high speed...
Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to...