EP62-1LPSPMed Product Information

EP62-1LPSPMed Two Component Epoxy

Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures Chemical and High Temperature Resistance

EP29LPHE Product Information

EP29LPHE Two Component Epoxy

Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Requirements. Optically Clear.

EP21TDC-2AOLV Product Information

EP21TDC-2AOLV Two Part Epoxy Compound

Two Component, Highly Flexibilized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.

EP39MAOHT Product Information

EP39MAOHT Two Part Epoxy System

Two Component, Low Viscosity, Room Temperature Curing Epoxy Resin System For High Performance Potting, Encapsulation, Sealing and Bonding Featuring Outstanding Resistance to Thermal Shock and Mechanical Vibration, Serviceable up to 450°F

UV22DC80-1 Product Information

UV22DC80-1 UV Curable System

One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.

Supreme 3HTLV Product Information

Supreme 3HTLV One Part Epoxy Adhesive System

One Component, No Mix, Toughened Epoxy for Bonding, Sealing and Coating Featuring Very Fast Curing, High Shear and Peel Strength Properties along with Superior Thermal Cycling Capabilities.

EP30M4LV-1 Product Information

EP30M4LV-1 Two Component Epoxy

Two Component, Room Temperature Curing, Low Viscosity Epoxy Compound for High Performance Bonding, Sealing, Casting and Potting Offering Superior Chemical Resistance and Excellent Physical Strength Properties.

EP21TDCN-LO Product Information

EP21TDCN-LO Two Part Epoxy System

Two Component Nickel Conductive Epoxy Adhesive for High Performance Bonding Featuring High Peel Strength, Superior Toughness and Low Volume Resistivity

EP3UF Product Information

EP3UF One Part Epoxy Adhesive System

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

EP3HTS-LO Product Information

One Component Epoxy Compound

One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.

Pages