Thermal Cycling Resistant

Supreme 3HTND-2DA Product Description

One component, toughened, electrically insulating epoxy for die attach applications

Supreme 45HTND-2LO Black Product Description

Toughened, two component epoxy system featuring high temperature resistance and NASA low outgassing

EP41S-F Product Description

Versatile, two part epoxy system for bonding, sealing, coating and encapsulating

Supreme 12AOHT-LO Product Description

One part, thermally conductive, electrically insulating, high performance epoxy for bonding and sealing; meets NASA low outgassing specifications

EP21AOLV-2Med Product Description

Two component epoxy compound for bonding, coating, sealing and encapsulation

FLM36-LO Product Description

B-staged film for high performance bonding and sealing, NASA low outgassing approved

EP38FLAO Product Description

Two component epoxy for potting, bonding, sealing and coating

EP3SP5FL Product Information

One component “snap cure” epoxy adhesive

EP46HT-1AO Product Description

Two part, thermally conductive, electrically insulative epoxy for bonding and sealing featuring outstanding heat resistance; requires oven curing



Formulated to operate over the wide temperature range of -80°F to +650°F, Master Bond EP17HT-LO is a...


Potting compounds offer superior protection for electronic circuits potting and encapsulation compounds are designed to...