EP3UF Product Information

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

EP3HTS-LO Product Information

One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.

EP21LVSP7 Product Information

Two component epoxy for bonding, sealing, coating and encapsulating

X5G Product Information

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

X5N Product Information

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

X-5SC Product Information

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

Supreme 45HTQ-4 Product Information

Two component epoxy system for bonding, sealing and casting

EP30-2LB Product Information

Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity; Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.

EP21NDCL Product Information

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

MasterSil 980 Product Information

One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.

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