One component, toughened, electrically insulating epoxy for die attach applications
Toughened, two component epoxy system featuring high temperature resistance and NASA low outgassing
Versatile, two part epoxy system for bonding, sealing, coating and encapsulating
One part, thermally conductive, electrically insulating, high performance epoxy for bonding and sealing; meets NASA low outgassing specifications
Two component epoxy compound for bonding, coating, sealing and encapsulation
B-staged film for high performance bonding and sealing, NASA low outgassing approved
Two component epoxy for potting, bonding, sealing and coating
One component “snap cure” epoxy adhesive
One component, thermally conductive epoxy adhesive
Two part, thermally conductive, electrically insulative epoxy for bonding and sealing featuring outstanding heat resistance; requires oven curing
Formulated to operate over the wide temperature range of -80°F to +650°F, Master Bond EP17HT-LO is a...
Potting compounds offer superior protection for electronic circuits potting and encapsulation compounds are designed to...