EP21TDC-2AOLV Product Information

Two Component, Highly Flexibilized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.

EP39MAOHT Product Information

Two Component, Low Viscosity, Room Temperature Curing Epoxy Resin System For High Performance Potting, Encapsulation, Sealing and Bonding Featuring Outstanding Resistance to Thermal Shock and Mechanical Vibration, Serviceable up to 450°F

UV22DC80-1 Product Information

One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.

Supreme 3HTLV Product Information

One Component, No Mix, Toughened Epoxy for Bonding, Sealing and Coating Featuring Very Fast Curing, High Shear and Peel Strength Properties along with Superior Thermal Cycling Capabilities.

EP30M4LV-1 Product Information

Two Component, Room Temperature Curing, Low Viscosity Epoxy Compound for High Performance Bonding, Sealing, Casting and Potting Offering Superior Chemical Resistance and Excellent Physical Strength Properties.

EP21TDCN-LO Product Information

Two Component Nickel Conductive Epoxy Adhesive for High Performance Bonding Featuring High Peel Strength, Superior Toughness and Low Volume Resistivity

EP3UF Product Information

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

EP3HTS-LO Product Information

One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.

EP21LVSP7 Product Information

Two component epoxy for bonding, sealing, coating and encapsulating

X5G Product Information

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

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