Master Bond liquid shims are epoxy materials designed for composite bonding applications. They eliminate gaps between composite surfaces and offer high compressive strength properties. Their high compressive strength makes them particularly useful for gap elimination in composite bonding applications. Master Bond liquid shims are custom formulated for optimal service in a wide range of environmental conditions, including withstanding exposure to fuel, water ingress, high/low temperatures. They are commonly used in aerospace applications, such as composite rib-to-skin assembly and other load bearing structures.
Toughened, thixotropic paste compounds can be applied vertically and have a long working life. Faster setting systems streamline production. Select grades cure at ambient temperatures or with moderate heat. Custom packaging in dual component cartridges (Semkits®) provides convenient handling and ease of usage, while ensuring consistent mix efficiency.
Some of the major benefits of Master Bond liquid shim adhesives include:
- High compressive strength
- Excellent lap shear strength
- Low slump
- Abrasion resistance
- Resistance to shock, vibration and impact
- Resistance to micro cracking upon high temperature exposure
- Two component, room temperature curing
- Can be stored at ambient temperatures
Master Bond Popular Products
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Supreme 11AOHT-LO Passes NASA low outgassing tests. Thixotropic paste viscosity. Convenient one to one mix ratio by weight or volume. High thermal conductivity. Excellent electrical insulation properties. Dimensionally stable. Withstands 1,000 hours 85°C/85% RH. Toughened system. Ability to resist rigorous thermal cycling. Service temperature range -112°F to +400°F. |
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EP30LTE-LO Two component epoxy system. Extra low thermal expansion coefficient and unmatched dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH. |
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EP42HT-3AO Thermally conductive, electrically insulative. Ideal for potting and encapsulation. Castable up to 3-4 inches. Excellent chemical resistance. Enhanced thermal cycling capabilities. Good flow. Serviceable from -100°F to +400°F. Impervious to intermittent exposures to steam. Shore D hardnes >80. |
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EP21NS Moderate viscosity Nanosilica epoxy resin system. High strength rigid bonds. Lower linear shrinkage after cure. Serviceable from -80°F to +250°F. Cures readily at room temperature. |
