For Superior Protection, Select Master Bond
Potting & Encapsulation Compounds

Master Bond Inc offers the widest selection of compounds and the technical expertise to help you meet your potting and encapsulation needs. From relays, connectors and power supplies to surge suppressors and telecommunication equipment, worldwide manufacturers rely on Master Bond for their most crucial applications. Our products are technologically advanced and are designed to simplify processing requirements. They are freshly prepared to ensure maximum shelf life. Environmentally friendly, they contain no solvents or diluents.

Our line of products consists of one and two component epoxies, silicones and polyurethanes. Single component UV curable systems are also available for use. Products vary in viscosity, cure speed, flexibility, electrical properties, thermal conductivity, chemical and temperature resistance, color, etc. Special formulations provide UL94V-0 flame resistance, high voltage insulation, enhanced thermal management properties, exceptionally low coefficients of thermal expansion, thermal shock resistance and are cryogenically serviceable, NASA low outgassing approved and meet USP Class VI requirements for medical usage. To learn more, contact us today.

Some of Our Most Popular
Potting & Encapsulation Systems...

We Solve Problems

With Master Bond, the customer comes first. Deal directly with a knowledgeable, experienced technical representative. We can recommend a system tailor-made to meet your requirements. We have over 30 years experience solving customer problems. Take advantage of our world class service and contact us today.

Master Bond Potting & Encapsulation Materials
Offer Protection from :

•  Thermal cycling •  Water •  Humidity •  Moisture •  Environmental extremes •  Hostile environments

•  Low temperatures •  High temperatures •  Corrosion •  Yellowing •  Vibration •  Impact

•  Thermal Shock •  Salts •  Inorganic acids •  Inorganic bases •  Organic solvents •  UV degradation

High Reliability & Performance

Master Bond's potting & encapsulation products are designed to offer superior quality and long term durability. They have earned a well deserved reputation for their performance upon exposure to hostile environmental conditions. Select from a wide range of systems conveniently packaged for ease of use. These compounds are available in different viscosities, cure times, chemical resistances, electrical properties, colors, etc. to best meet specific requirements. They are presently employed in applications ranging from design and production to repair, maintenance and field service.

Important Potting & Encapsulation System
Performance Requirements

Typical Applications for Master Bond
Potting & Encapsulation Systems

•  Cable sealing •  Wire wound devices •  Electronic circuits •  Electric components •  Power devices/supplies •  Transformer coils •  Instrument transformers •  Current transformers •  Ensuring dimensional stability •  Power line filters •  Automotive control modules •  Power modules •  Power converters •  Batteries •  Ballasts •  Casting rubber release rolls •  Heat dissipation •  Protection of microelectronic devices •  Hybrid circuits •  LEDs •  PCBs •  Medical instrumentation •  Motors •  MCMs (multi-chip modules) •  Pumps •  Engine control modules •  Display embedments •  Sealing capacitors •  Semiconductor packages •  Electronic marine modules (EMMs) •  High density circuit assemblies •  Infiltrate around densely packed components •  High voltage electrical components •  Stress relief from mechanical and thermal stresses •  Electronic subcomponents and sub-assemblies •  Enhance load bearing characteristics •  Strain sensitive components and circuitry •  Electronic control modules (ECMs) •  Packaging electronic components and assemblies •  Underfill •  Timers •  Diagnostic instruments •  Tamper proofing •  Dielectric applications •  Chemical pump base •  Switches •  Electric insulator •  Heat insulator •  Surge suppressors •  Computers •  Strain relief or chip encapsulation •  Flame retardance •  Connectors •  Sensors •  Industrial controls •  Amplifiers •  High voltage resistor packs •  Relays •  Solar cells •  Measuring equipment •  Test equipment •  Computer printers •  Security protection products •  Appliances •  Climate control systems •  Endoscopes •  Ignition control modules •  Detectors •  RF circuits •  Glop top assemblies •  Inductors •  Filters •  Prevents reflection and loss of intensity during light transmission •  Coatings for integrated circuit devices in various package designs (DIP, PGA and cavity packs) •  In heat generating electronic devices such as bridge rectifiers, thermistors, and thermal probes •  High voltage applications where surface arcing or tracking is a concern •  Various automotive, electronic, military and industrial components •  Thermal insulation for ablative applications (state change applications that redirect heat and energy) •  Telecommunications applications such as stub cables or load coils •  Airborne applications (requiring low weight and excellent dielectric properties) •  Applications that have rigid or flexible wire leads protruding directly from the encapsulation •  Imaging devices such as laser scanner beds, internal & external drums for image setters and CTP plate setters •  Improves the sensitivity of many optical devices: fiber optics, electro optic systems & lens assemblies, as well    as other light sensing instruments

GET THE MASTER BOND ADVANTAGE Deal direct with the manufacturer — no middlemen or distributors We solve problems — the technical expertise and experience you need Widest selection of formulations — over 3,000 grades available Custom formulations — if you have special requirements Master Bond will custom formulate a system to meet your needs Highest quality products — consistent reproducible high performance systems Latest technological developments — cutting edge technology Packaging solutions — for easy, efficient application Select from an extensive range of sizes to accommodate your needs Prompt service — speedy processing of orders Master Bond — Problem Solved