Expanded Product List
Master Bond Product Search
179 products match
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Supreme 11AO Thermally conductive/electrically isolating epoxy adhesive/sealant. Ambient temperature curing. Convenient one to one mix ratio by weight or volume. Thick paste. High peel and shear strength. Toughened system. Well suited for bonding dissimilar substrates. Service temperature range -100°F to +250°F. |
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Supreme 11AOHT Thermally conductive, electrically insulative epoxy adhesive. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High peel and shear strength properties. Non-drip system. Resists -112°F to +400°F. Toughened system. Can withstand rigorous thermal cycling. Convenient one to one mix ratio by weight or volume. Cures at room temperature. |
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Supreme 11AOHT-LO Passes NASA low outgassing tests. Thixotropic paste viscosity. Convenient one to one mix ratio by weight or volume. High thermal conductivity. Excellent electrical insulation properties. Dimensionally stable. Withstands 1,000 hours 85°C/85% RH. Toughened system. Ability to resist rigorous thermal cycling. Service temperature range -112°F to +400°F. |
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Supreme 11AOHTLP Thermally conductive, electrically insulative epoxy adhesive. High peel and shear strength properties. Non-drip system. Resists -100°F to +400°F. Toughened system. Can withstand rigorous thermal cycling. Convenient one to one mix ratio by weight or volume. Cures at room temperature. Long working life. |
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Supreme 11AOHTMed Thermally conductive, electrically insulative epoxy adhesive. Meets ISO10993-5 for cytotoxicity. High lap shear strength properties. Non-drip system. Resists -112°F to +400°F. Toughened system. Can withstand rigorous thermal cycling. Convenient one to one mix ratio by weight. Versatile cure schedules. |
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Supreme 121AO Thermally conductive, electrically insulative. Outstanding dimensional stability. Passes NASA low outgassing tests. Very long open time. Ideally suited for potting applications. Serviceable from -80°F to +550°F. Black in color. Requires oven curing. |
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Supreme 121AOMed Thermally conductive, electrically insulative. Outstanding dimensional stability. Passes ISO 10993-5 tests. Very long open time. Ideally suited for potting applications. Serviceable from -80°F to +550°F. Black in color. Requires oven curing. |
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Supreme 121AOND Thermally conductive, electrically insulative. Outstanding dimensional stability. Passes NASA low outgassing tests. Very long open time. Paste consistency. Ideally suited for potting applications. Serviceable from -80°F to +550°F. Black in color. Requires oven curing. |
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Supreme 12AOHT-LO One component, heat cure system for bonding, sealing. High strength product. Service operating temperature range from 4K to +500°F (260°C). Resists aggressive thermal cycling and shock. Substantial thermal conductivity of 9-10 BTU in/ft2 hr °F. Smooth thixotropic paste. NASA low outgassing approved. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Withstands 1,000 hours 85°C/85% RH. |
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Supreme 18TC single component epoxy adhesive features unmatched heat transfer properties. Capable of being applied in bond lines as thin as 10-15 microns. Low coefficient of thermal expansion. Meets NASA low outgassing specifications. Low shrinkage upon curing Operating temperature is 4k to +400°F. |