
EP11HT Product Description
One Component, Heat Curing Structural Adhesive Featuring High Shear Strength and High Temperature Resistance for Optimal Bonding Performance Up To 400°F
Master Bond Polymer System EP11HT is a one component, heat curing, structural epoxy adhesive featuring high shear strength, easy handling and high temperature resistance. This one component system is formulated to cure at elevated temperatures, e.g. 90120 minutes at 250°F or 6090 minutes at 300°F. The minimum cure temperature is 250°F. EP11HT attains tensile shear strengths in excess of 3,300 psi and forms rigid and dimensionally stable bonds. The service temperature range is 60°F to 400°F. As a one part system, it does not require mixing prior to use and has an unlimited working life at room temperature. EP11HT bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics. It has excellent resistance to a wide range of chemicals including acids, bases, oils, salts and many solvents. A non-drip version called EP11HTND2 is also available. Both systems are 100% reactive and do not contain any solvents or volatiles. The standard color is tan, but other colors are available.
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- Epoxy |
- Heat Cure |
- Non-Drip |
- Dimensionally Stable |
- Electrically Insulative |
- High Temperature Resistant |
- High Shear Strength |

