Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than lOOO psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Adhesive EP21TP-2 can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough, flexible bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -80°F to 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive/sealant is an electrical insulator. Color of part A tan, part B amber. Master Bond EP21TP-2 adhesive/sealant is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. The cured adhesive fully meets the requirements for polysulfide/epoxy type sealants.