EP21TPFL-1AO Product Description

Master Bond Polymer System EP21TPFL-1AO is a two component highly flexible polysulfide modified epoxy featuring superior thermal conductivity and good electrical insulation properties. It can be used for bonding, sealing, potting and coating. It retains superb chemical resistance to fuels and water. It has been formulated to cure readily at ambient and more quickly at elevated temperatures with a user friendly noncritical 2:3 mix ratio, by weight or volume. The low viscosity facilitates easy mixing of the two components. This compound is 100% reactive, does not emit any volatiles during curing and contains no hazardous ingredients. The color of part A is black while part B is dark brown.

The Master Bond Polymer System EP21TPFL-1AO has excellent physical strength, high impact resistance and remarkably superior electrical insulation properties. These desirable properties are maintained even upon prolonged exposure to hostile environmental conditions including high and low service temperatures and immersion in fuels and water. Dimensional stability is retained after extended aging in various environments. Adhesion to most substrates is excellent. Although highly flexible, its chemical resistance profile is vastly superior to urethanes and silicones. Its wide service temperature range extends from -65°F to +250°F. EP21TPFL-1AO is widely employed in electronic and related electrical applications. The low viscosity of EP21TPFL-1AO is ideal for small to moderate size potting and castings. The shelf life is 6 months in unopened containers.