EP30LTE Product Description

Master Bond EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing and casting. This two component epoxy resin compound, which cures readily at ambient or more quickly at elevated temperatures, represents the long desired technical breakthrough of a significant reduction in the high thermal expansion coefficients characteristic of epoxies and all other organic polymers while retaining their advantageous properties and ease of processability. EP30LTE-LO is formulated with a unique blend of polymeric and inorganic materials so as to obtain thermal expansion coefficients as low as 12x10^-6 in/in/°C as well as unmatched dimensional stability. This makes possible new standards of performance for bonding, sealing and casting applications. Shrinkage upon cure is exceptionally low—less than 0.0002 in/in.

EP30LTE-LO cures to a high strength solid which features unexcelled resistance to thermal cycling over the wide temperature range of -60°F to +250°F. It is 100% reactive and does not contain any solvents or diluents. The cured material is an excellent electrical insulator and has superior chemical resistance to many chemicals including water, fuels, many organic solvents as well as diverse acids, bases and salts. It produces high strength durable bonds to many similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and most plastics. Master Bond EP30LTE-LO is setting new quality and performance specifications in the electronic, electrical, computer, optical, aerospace and chemical industries.

Product Advantages

• Convenient mixing: easy-to-use mix ratio, ten to one by weight.
• 100% reactive—no diluents or solvents.
• Compound flows and spreads evenly and smoothly. Suitable for bonding, sealing & casting applications.
• Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as desired.
• High bonding strength to similar and dissimilar substrates.
• Exceptionally low shrinkage upon cure: less than 0.0002 in/in.
• Extra low thermal expansion coefficient: less than 12x10^-6 in/in/°C.
• Superior thermal shock resistance, durability and chemical resistance over the wide temperature range of -60°F to +250°F.
• Good thermal conductivity.
• Passes NASA low outgassing tests.