MB6A Product Description

Master Bond MB6A is a remarkably effective solvent composition for deflashing and decapsulation of cured epoxy resin compounds. It initiates and promotes disintegration by flaking and breaking rather than pure solvent action. Master Bond MB6A is most effective when used hot. It does not discolor or attack metals or platings commonly employed in electronic assemblies. Master Bond MB6A is completely miscible with water. MB6A may be discharged into aqueous waste streams, consult prevailing pollution regulations before discharging into the waste stream. It is 100% biodegradable.

Master Bond MB6A will disintegrate most epoxy resins when used hot. The preferred temperature range for use is 220 to 350°F (105 to 175°C). It is not a selective system and will attack certain thermoplastics including wire coating insulations and some thermoset coatings. It does not attack most metals or platings used in electronic assemblies and is also a superior solvent for the removal or carbonized fluxes. Master Bond MB6A has proven to be particularly effective for deflashing use of IC's and also various solid state devices.