
Supreme 10HTFL Product Description
Flexibilized, One Component Epoxy Adhesive/Sealant Featuring Outstanding Shear and Peel Strength; Serviceable from 4°K to 350°F. Requires Minimum Cure Temperature of 250°F.
Master Bond Polymer System Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to +350°F making it suitable for cryogenic applications. Supreme 10HTFL features highly desirable handling properties including no mixing and unlimited working life at room temperature. It should be noted that this one part epoxy requires a curing temperature of 250°F or above.
Supreme 10HTFL has a unique blend of advantageous physical and mechanical properties. It is a forgiving epoxy, i.e. far less rigid than typical high temperature resistant epoxies. Supreme 10HTFL also allows for superior resistance to impact, thermal and mechanical shock and vibration, and is well suited for rigorous thermal cycling. The adhesive is often used when bonding substrates with different coefficients of thermal expansion. It is 100% reactive and does not contain any diluents or solvents.
Master Bond Polymer System Supreme 10HTFL's chemical resistance is noteworthy, especially including water, oil, fuels and many solvents even upon prolonged exposure in hostile environments. It has excellent adhesion to metals, glass, ceramics, wood, and many rubbers and plastics. When cured, the epoxy is a very good electrical insulator. Its normal color is gray. A non-drip version called Supreme 10HTFLND-2 is available, which will not flow when cured. Master Bond Polymer System Supreme 10HTFL features high performance coupled with convenient handling making it widely used in a variety of applications in the aerospace, electronic, OEM, electrical, computer, metalworking and chemical industries.
Product Advantages
- Single component system; no mixing needed prior to use, unlimited working life at room temperature.
- Room temperature storable; Optimum shelf life obtained when refrigerated; Do not freeze.
- Versatile fast cure schedules; 75-90 minutes at 250°F; 45-60 minutes at 300°F.
- High bond strength to similar and dissimilar substrates over the wide temperature range of 4K to over 350°F; cryogenically serviceable.
- Very good electrical insulating properties.
- Highly resistant to thermal cycling, mechanical and thermal shock.
- 100% reactive - no volatiles present; thixotropic.
Explore more products...
- Epoxy |
- Heat Cure |
- Cryogenic |
- Non-Drip |
- Electrically Insulative |
- High Temperature Resistant |
- High Peel Strength |
- Thermal Cycling Resistant |
- High Shear Strength |
- Flexibilized & Toughened |
- Vibration, Shock & Impact |
- Low Stress |

