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Supreme 3HT Product Description

One Component, Low Temperature Heat Curing Epoxy Adhesive Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance.

Master Bond Polymer System Supreme3HT is a storage stable one component, heat curing epoxy adhesive featuring a hither to unattainable balance of performance properties including both high shear and high peel strength, plus the convenience of a fast cure at low temperatures if desired. This new one component adhesive system is formulated to cure by exposure to a wide range of elevated temperatures, from as low as 220°F (104°C) to 350°F (177°C) and higher, (minimum cure temperature 215-220°F). Tensile shear strengths in excess of 1800psi and T-peel strengths over 20pl are readily obtained. No mixing is necessary prior to use.

Master Bond Polymer Adhesive Supreme 3HT produces remarkable good performance bonds with both high shear and high peel strength for service in the wide temperature range of below -100°F to +350°F. It offers very superior resistance to impact, thermal shock, vibration and stress fatigue cracking while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. Master Bond Adhesive Supreme 3HT can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents.

Master Bond Polymer Adhesive Supreme 3HT produces durable high strength and exceptionally tough bonds after only short cures at low temperatures which are remarkably resistant to severe thermal cycling and many chemicals including water, oil, fuels and most organic solvents even upon prolonged exposures. Unlike many other epoxy adhesives, its performance is relatively insensitive to changes in cure schedules or substrate cleaning procedures. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is a superior thermal insulator. Color is brown.

Master Bond Polymer Adhesive Supreme 3HT offers the convenience of fast heat cures at a wide range of temperatures with no mixing prior to use and a uniquely favorable bonding performance for difficult applications in the aerospace, electronic, electrical, computer, metalworking, appliance, automotive and chemical industries, especially where heat sensitive substrates limit permissible temperatures for curing adhesives.

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