As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices.
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