One component, heat cured epoxy system for bonding, sealing, dam-and-fill applications. Resists temperatures up to +600°F. Thermally conductive, electrically insulating.
One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic paste.
One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic, moderate viscositiy.
One Component, Higher Viscosity UV Curable System for High Performance Bonding, Sealing and Coating, Featuring Excellent Physical Properties, Dimensional Stability and Chemical Resistance with an Outstanding Tg
