Low Outgassing

EP30HT Product Information

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Potting Featuring Optical Clarity and High Temperature Resistance. Conforms to FDA Section 175.105 for Indirect Food Applications.

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EP30LTE-LO Product Information

Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion and Passes NASA Outgassing Tests with Low Shrinkage Upon Cure.

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EP30QF Product Information

Quartz Filled, Two Component Epoxy System for High Performance Bonding, Sealing, Coating & Casting, Featuring Exceptionally Low Shrinkage and High Dimensional Stability.

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EP34AN Product Description

Two Component, Room Temperature Curing Epoxy System Featuring High Temperature Resistance And Exceptionally High Thermal Conductivity.

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EP36AO Product Information

One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.

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EP37-3FLFAO Product Information

Two component epoxy compound for potting, bonding, sealing and coating

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EP42HT-2AO-1 Black Product Information

Two Component, Thermally Conductive, Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System with Excellent Chemical Resistance and Electrical Insulation Properties. Ideal for Potting & Encapsulation Applications. Passes NASA low outgassing. Cryogenically Serviceable.

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EP42HT-2LO Product Information

Two Component, Room Temperature Curable, Epoxy Adhesive, Sealant, Coating and Casting System Featuring High Temperature Resistance. Meets NASA Low Outgassing Specifications.

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EP46HT-2AO Black Product Information

Two Component, Thermally Conductive, Electrically Insulating Epoxy for High Performance Bonding, Sealing and Encapsulation. Features a Glass Transition Temperature in Excess of 200°C; Requires Elevated Temperature Curing at 250°F or Above. Meets NASA Low Outgassing.