Master Bond One And Two Component
Electrically Conductive Adhesive Systems

Master Bond’s line of electrically conductive adhesives is the number one choice for the design of tomorrow’s advanced electrical circuitry. Nobody offers more choices or solutions. The Master Bond product line includes silver, nickel, copper and graphite filled compounds. We even offer silver coated nickel systems for low resistance where cost effectiveness is crucial. Specific compounds are designed to cure at ambient temperatures or upon brief exposure to elevated temperatures. The cured products offer high physical strength, superior substrate adhesion and uniform electrical conductivity even upon exposure to hostile environmental conditions. Long term durability is excellent.

Our electrically conductive products consist of epoxies and elastomeric systems. They are conveniently packaged for ease of use. They are available in syringes, jars, bubble packs, cartridges, etc. Two component systems can be purchased in premixed, frozen syringes. Freshly prepared to maximize shelf life, Master Bond electrically conductive compounds can be bought in quantities from grams to gallons.

The superior performance profile of our electrically conductive compounds is widely recognized throughout the electronics industry. Special grades are vibration and shock resistant, cryogenically serviceable, “snap curing”, offer exceptional peel and shear strength and are screen printable. Additionally, NASA low outgassing approved adhesives and a USP Class VI approved system for medical applications is also available. To learn more, contact us today.

Some of Our Most Popular
Electrically Conductive Adhesive Systems...

We Solve Problems

Our knowledgeable, experienced technical specialists will be glad to assist you in selecting the proper system for your specifications. We provide personal “one-on-one” assistance. Put our expertise to work for you. Take advantage of our world class service and contact us today.

Important Electrically Conductive
Performance Requirements

High Reliability & Performance

Master Bond's electrically conductive products are designed to offer superior quality and long term durability. They have earned a well deserved reputation for their performance upon exposure to hostile environmental conditions. Select from a wide range of systems conveniently packaged for ease of use. These compounds are available in different viscosities, cure times, chemical resistances, electrical properties, colors, etc. to best meet specific requirements. They are presently employed in applications ranging from design and production to repair, maintenance and field service.

Typical Applications for Master Bond
Electrically Conductive Adhesive Systems

•  Assembly and repair of electrical modules •  Assembly and repair of PCBs •  Assembly and repair of high frequency shields •  Assembly and repair of wave guides •  Assembly and repair of flat cable •  EMI/RFI shielding •  Entertainment systems •  Formation of specialty heat sinks •  Solder replacement •  Repair of interconnections •  Radar DSPs (digital signal processors) •  Sonar DSPs (digital signal processors) •  Bonding metal leadframes •  Solar cell manufacturing •  Electrical ground plane interface •  High-power electronics modules •  RFID tagging •  PWB (printed wiring board) applications •  LED packages-attaching LEDs to the die •  Wireless headsets •  Wafer lamination •  Stack bonding •  Copper/polymide (PI) circuits •  Multilayer hybrid integrated circuits •  Low temperature flip chip packaging •  Cabinet card shielding •  Specialty thermistors •  Microprocessors •  Stress control devices •  Wire tacking •  SMD Attachment •  Hermetic lid-seal processes •  Communication systems •  Electronic test equipment •  Microwave shielding •  Heat dissipation applications •  RF power applications •  Plastic IC packaging •  Hybrid microelectronic packaging •  Roadside assistance systems •  Membrane Switches •  Microwave applications •  Electronic assembly in pumps •  Smartcard IC assembly •  Antenna systems •  Bonding polyimide flex circuits to printed circuit boards •  Used to make electrical connections where hot soldering is impractical ("cold solder") •  Used for making connections to PZT electrodes (lead zirconate titanate) in ultrasound applications •  Electrical and mechanical bonding of semiconductor, capacitor, and resistor chips/networks    in micro and opto-electronic hybrid circuit fabrication •  Environmental SEMs [scanning electron microscopes (used in forensic analysis, for example)] •  EMP (electro magnetic pulse) protection-coating system engineered to interact, through    absorption or reflection, with specific regions of the electromagnetic energy spectrum resulting    in EMP protection-used in the military and in other industries •  Electrical contact systems used in relays, switches, keys, plug connectors, small DC motors,    potentiometer, signal transfer, measuring •  Adhering to metals such as Au, Cu, OSP/Cu (organic solderable preservatives), Ag, and Ag-Pd •  Opto-electronic packaging material: LED, LCDs, and fiber optic components •  Die attach applications [such as in MID components    (mobile internet device)] •  Used in place of Sn/Pb (tin/lead) solder balls in BGA, PPGA,    and microBGA packaging, controls, & position sensors •  Wafer carriers for stacking wafers for use during    transport/storage •  RF/Microwave device packaging found in commercial,    aerospace and cockpit, and industrial (down-hole    petrochemical) circuits •  Heat sensitive substrates (such as polyester film    and cell phone keypads and displays) •  Protect from corrosion, when other methods are impractical

Master Bond offers adhesives for the following substrates:

GET THE MASTER BOND ADVANTAGE Deal direct with the manufacturer — no middlemen or distributors We solve problems — the technical expertise and experience you need Widest selection of formulations — over 3,000 grades available Custom formulations — if you have special requirements Master Bond will custom formulate a system to meet your needs Highest quality products — consistent reproducible high performance systems Latest technological developments — cutting edge technology Packaging solutions — for easy, efficient application Select from an extensive range of sizes to accommodate your needs Prompt service — speedy processing of orders Master Bond — Problem Solved