Master Bond Thermally Conductive Adhesives, Sealants,
Coatings, and Potting & Encapsulation Compounds
Offer Superior Heat Dissipation

Thermal management is of crucial importance to the electronics industry. Smaller, tightly packaged circuits and components create heat which ultimately affects the reliability and life of numerous electronic devices. With expectations for further miniaturization, the need for compounds to mitigate these problems is essential. In response to these needs, Master Bond has been in the forefront of developing thermal conductive compounds with superior performance properties.

Master Bond manufactures one and two component thermally conductive systems. They include epoxies, silicones and other elastomeric systems. Special formulations for unusual service conditions are available. They include serviceability to 500°F, at cryogenic temperatures, and in high vacuum environments as well as systems that are easily repairable. Designed for easy application, these compounds can be purchased in convenient packaging. They are used on heat sinks, fan sinks, package lids, motor controls, multiplexers, sensors, power semiconductors and thermistors. Toughened systems have been successfully employed in applications requiring resistance to shock, vibration and thermal cycling. To learn more, contact us today.

Some of Our Most Popular Thermally Conductive Systems...

We Solve Problems

Master Bond has the technical expertise to provide you the assistance you require. With Master Bond, the customer comes first. Speak directly to a knowledgeable, experienced technical representative. We have over 30 years of skill solving customer problems. Take advantage of our world class service and contact us today.

Important Thermally Conductive System
Performance Requirements

High Reliability & Performance

Master Bond's thermally conductive products are designed to offer superior quality and long term durability. They have earned a well deserved reputation for their performance upon exposure to hostile environmental conditions. Select from a wide range of systems conveniently packaged for ease of use. These compounds are available in different viscosities, cure times, chemical resistances, electrical properties, colors, etc. to best meet specific requirements. They are presently employed in applications ranging from design and production to repair, maintenance and field service.

Typical Applications for Master Bond
Thermal Conductive, Electrically Insulating Systems

•  Potting modules •  Adhesive for power supply components •  Navigation systems •  SECC format devices and microprocessors •  Potting/encapsulating sensors •  Pin sealing •  Satellite radio receivers for heat dissipation •  Electric heating systems •  Adhesive for ink jet printer heads •  Voltage regulators •  Barrier to environmental contamination •  Alarm systems •  Battery monitoring systems •  Control units •  Attachments involving semiconductors •  Use in aerospace environments (NASA approved) •  BGA-die heat spreader interface •  Bond flexible/rigid circuit boards •  SMD (surface mounted devices) attach •  Die attach hybrid/MCM (multi chip module) •  Noise filters •  Wafer lamination (thin slice of semiconductor material) •  Bonding high power LEDs to PCBs •  Screen printing for heat dissipation •  Adhesive specialties for uniform bondline thickness •  In-line bonding •  Stack chip bonding •  Barrier to shock and vibration isolation •  Sealing filter media to metal end caps •  Bonding ICs (integrated circuits) with heat sinks •  Electric fuel injection systems •  Airbag controllers •  Connector sealing •  Instrument panel systems •  Detectors •  Ground plane bonding •  Antenna systems •  Wireless communications •  Satellite transmissions •  Substrate attachments •  Potting power supplies •  Lid bonding •  Potting and cavity filling •  Cryogenic applications •  Cooling fan controllers •  CSPs (chip-scale packages) •  Base plate attach •  Rapid curing thermal systems for high volume assembly •  Mounting heat sinks and heat sensitive electronic components •  Power conversion-automated power semiconductor attachment •  Thermal bridge to fill gaps between heat sources and heat sinks of power components •  Dissipate heat around electrical components in various machine parts •  RF power applications (radio frequency amplifier converts a low-power radio-frequency signal    into a larger signal of significant power) •  Rapid curing thermal systems for packaging materials including ceramic, metal hybrid    packages, organic boards and semiconductor materials •  Selected and specialized RFID Tags (radio frequency identification tags) •  Encapsulating, potting and casting of transformers, sensors, coils (such as chokes and    solenoids, and high vibration coils) and micro circuitry •  Bonding components with mismatched coefficients of thermal expansion •  Staking transistors, diodes, resistors, integrated circuits and other thermal-sensitive    components to printed circuit boards •  Bonds to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics •  Excellent resistance to weathering, water, salts, and many other organic and inorganic    compounds, mild acids and alkalis, and many other chemicals including petroleum    solvents, lubricating oils, and alcohol •  Heat transfer between an active device and a heat spreader or heat sink •  Strong, durable electrically insulating/thermally conducting bonds producing good     temperature and impact resistance •  Repair of electrical modules, printed circuits, wave guides, flat cables & high frequency shields •  Rectifiers (electrical device that converts alternating current to rectified direct current)

GET THE MASTER BOND ADVANTAGE Deal direct with the manufacturer — no middlemen or distributors We solve problems — the technical expertise and experience you need Widest selection of formulations — over 3,000 grades available Custom formulations — if you have special requirements Master Bond will custom formulate a system to meet your needs Highest quality products — consistent reproducible high performance systems Latest technological developments — cutting edge technology Packaging solutions — for easy, efficient application Select from an extensive range of sizes to accommodate your needs Prompt service — speedy processing of orders Master Bond — Problem Solved