New Products

Low to Moderate Viscosity, Toughened Two Component Epoxy System for High Performance Casting, Bonding and Sealing

USP Class VI Approved Silicone Potting & Encapsulation Compound Withstands Vibration, Impact, Shock and Thermal Cycling

UV Curable Compound With Superior Gap Filling Properties

Epoxy For High Temperature Service Up To 600°F

Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components

UV Curable Nanosilica Filled Epoxy Has Outstanding Physical Strength and Exceptional Abrasion & Chemical Resistance

Rigid, Room Temperature Curing Thermal Conductive Epoxy For Service Up To 400°F

Epoxy Impregnant Seals Metals & Nonmetals

New Epoxy System Has Exceptionally High Thermal Conductivity

One Part Epoxy Adhesive Resists High Temperatures

New Low Viscosity Adhesive/Sealant Cures at Room Temperature

New Cost Effective, High Conductivity Epoxy

New USP Class VI Approved Epoxy Adhesive Cures Rapidly at Room Temperature

Thermally Conductive, Electrically Isolating Epoxy Resists High Temperatures

NEW USP Class VI Approved Adhesive is Optically Clear

New Epoxy Adhesive Serviceable At Cryogenic Temperatures

New Polymer System Cures by UV Light and/or Heat

New Flexible, Low Viscosity Potting Compound

New Highly Flexible Silver Conductive Epoxy Adhesive

New Flexible Low Viscosity Silicone Compound

Epoxy Cures at Low Temperature

Flexible Epoxy Resin with Unexcelled Shear/Peel Strength for High Performance Bonding, Sealing and Casting to Engineering Plastics Particularly Polycarbonates and Acrylics As Well As To Metals

Flexible, Low Outgassing Epoxy Resin Compound Has High Thermal Conductivity

Adhesive Resists Up To 400°F

Low Viscosity Epoxy Features Excellent Adhesion to Glass, Polycarbonates & Acrylics

New One Part Silicone Elastomer Has High Transparency to Visible Light

New One Part UV and Heat Curable Epoxy System

New Medium Viscosity, Optically Clear Epoxy System Resists Up to 400°F

New USP Class VI Approved Epoxy Adhesive Resists Sterilants

New One Component Flexible High Performance Epoxy Based Adhesive/Sealant Has Long Term Ambient Temperature Storage Capability

New One Component Adhesive/Sealant Resists Up To 600°F

New High Strength One Part Epoxy Adhesive Cures at 80°C

New Two Component Nickel Conductive Epoxy Adhesive

USP Class VI Approved Adhesive Resists Exposure to Repeated Sterilization

A New Flexible, Low Viscosity UV Curable Compound Specially Designed For High Performance Laminating, Sealing, Bonding and Coating

Silver Conductive Epoxy Adhesive Has Rapid Set Up Time

High Temperature Resistant Epoxy Has Exceptional Thermal Conductivity

New Room Temperature Curing Epoxy Resists Sterilization

New Fast Curing Epoxy Adhesive

New Epoxy Adhesive Resists High Temperatures

Thermal Conductive Adhesive has Convenient One to One Mix Ratio

Rapid Curing Epoxy Adhesive Has High Flexibility

Aluminum Filled Epoxy Available For Enhanced Machinability

High Temperature Resistant Epoxy Offers Outstanding Chemical Resistance

One Component Silver Conductive Adhesive System Meets NASA Outgassing Test Requirements

New Tough, Resilient Adhesive Resists High Impact