Master
Bond Inc. has developed various "low outgassing" epoxy
resin based adhesive systems to meet the maximum 1% TML and maximum
0.1% CVCM acceptability criteria as outlined in ASTM E595-93. Some
of these have been tested by NASA authorized facilities while others
have been independently tested. These adhesives comprise both two
and one component compositions requiring either ambient or elevated
temperature cures as specified below. These "low outgassing"
epoxy adhesive compounds are manufactured with exceptionally high
quality standards in order to assure reproducible high performance
even under the most demanding service conditions. Master Bond's
specialty low outgassing systems include those that are optically
clear, cryogenically serviceable,
electrically conductive,
thermally conductive/electrically
insulative and high temperature
resistant. It should be noted that all systems should be fully
cured prior to any low outgassing-application.
These epoxies are widely used in applications such as
High Vacuum Applications
Photonics Sensors & Related Devices
Optical Components & Coatings
Aerospace Assemblies
Optical & Magnetic Disk Systems & Media
Flat Panel Displays & Other Imaging Systems
LED Systems & Various Other Advanced Autoelectronic Products
Master
Bond Inc. has developed various "low outgassing" epoxy
resin based adhesive systems to meet the maximum 1% TML and maximum
0.1% CVCM acceptability criteria as outlined in ASTM E595-93. Some
of these have been tested by NASA authorized facilities while others
have been independently tested. These adhesives comprise both two
and one component compositions requiring either ambient or elevated
temperature cures as specified below. These "low outgassing"
epoxy adhesive compounds are manufactured with exceptionally high
quality standards in order to assure reproducible high performance
even under the most demanding service conditions. Master Bond's
specialty low outgassing systems include those that are