EP21

100/100

“A” gray
“B” tan

50,000-60,000

60-90

24-48 hrs @ RT
2 hrs @ 200°F

-60 to +250°F

High performance general purpose adhesive, sealant and coating.  Can alter mix ratio to vary toughness and flexibility.

EP21AO

100/100

“A” gray
“B” white

light paste

45-60

24-48 hrs @ RT
2-3 hrs @ 200°F

-60 to +250°F

Thermally conductive version of EP21.  Used primarily for bonding and sealing.

EP21AOLV

100/100

“A” gray
“B” white

40,000-50,000

75-90

24-48 hrs @ RT
2-3 hrs @ 200°F

-60 to +250°F

Lower viscosity version of EP21AO.  Easy to use, thermally conductive potting material/encapsulant.

EP21AN

100/100

“A” gray
“B” white

light paste

60-90

24-48 hrs @ RT
2-3 hrs @ 200°F

-60 to +250°F

Higher thermally conductive version of EP21AO,  Thermal conductivity at 75°F >22 BTU•in/ft² •hr•°F.

EP21AR

100/50

“A” clear
“B” amber

10,000-15,000

30-35

24-48 hrs @ RT
2-2½ hrs @ 200°F

-60 to +275°F

Superb resistance to inorganic and many organic acids.  For bonding, sealing and coating.

EP21BAS

100/100

“A” off white
“B” off white

>175,000

60-90

48-60 hrs @ RT
2-3 hrs @ 200°F

-60 to +250°F

Radio opaque adhesive/sealant/coating for medical and medical electronic applications.

EP21FL

100/25

“A” amber
“B” amber

3,000-4,000

120-180

24-48 hrs @ RT
2-3 hrs @ 200°F

-60 to +250°F

Flexible version of EP21.  Superior thermal cyclability, shock and impact resistance.  Excellent adhesive/sealant.

EP21FRLVSP

100/100

“A” red
“B” white

25,000-30,000

30-60

24-48 hrs @ RT
2 hrs @ 200F

-60 to +250°F

Flame retardant. UL94 V-0 certified system.  For potting and bonding.

EP21HT

100/100

“A” clear
“B” amber

50,000-60,000

50-70

24-48 hrs @ RT
2 hrs @ 200°F

-60 to +400°F

High temperature resistant version of EP21 with excellent chemical resistant properties. Convenient handling.

EP21LSCL

100/60

“A” clear
“B” clear

1,000-1,500

30-35

24 hrs @ RT
1-2 hr @ 200°F

-65 to +250°F

Transparent, non-yellowing version of EP21 for bonding, sealing and coating.  For optical and display applications.

EP21LV

100/100

“A” clear
“B” amber

6,000-8,000

60-90

24-48 hrs @ RT
1-2 hrs @ 200°F

-60 to +250°F

Lower viscosity than EP21.  Food grade & USP Class VI certified.  For bonding, sealing, coating & encapsulation.

EP21ND

100/100

“A” gray
“B” tan

paste

45-60

24-48 hrs @ RT
2 hrs @ 200°F

-60 to +250°F

Non drip version of EP21.  Suitable for vertical applications.  Excellent adhesive/sealant.

EP21ROK

100/100

“A” gray
“B” light tan

moderate
paste

90-120

24-48 hrs @ RT

-60 to +250°F

Durable, tough, “no-skid” flooring with high chemical resistance.

EP21TCHT-1

100/66

“A” off white
“B” off white

light
paste

30-35

18-24 hrs @ RT
1-2 hrs @ 200°F

4°K to +400°F

NASA approved low outgassing; thermally conductive, for bonding and sealing.  Cryogenically serviceable.

EP21TDC

100/100

“A” clear
“B” amber

40,000-50,000

60-75

24-48 hrs @ RT
2 hrs @ 200°F

-100 to +250°F

Excellent general purpose adhesive/sealant.  Convenient handling.  Good impact & shock resistance.

EP21TDC-2

33/100

“A” clear
“B” amber

70,000-80,000

75-90

72 hrs @ RT
2-3 hrs @ 200°F

4°K to +250°F

Highly flexible with exceptional thermal and mechanical shock resistance.  Suitable for cryogenic applications.

EP21TDC-2AO

33/100

“A” white
“B” off white

paste

90-120

48-72 hrs @ RT
3 hrs @ 200°F

-100 to +250°F

Thermally conductive version of EP21TDC-2.  Particularly well suited for bonding dissimilar substrates.

EP21TDC-7

100/700

“A” clear
“B” amber

120,000-140,000

120-150

48-96 hrs @ RT
3-4 hrs @ 200°F

-100 to +250°F

Ultra high flexibility.  Exceptional for bonding most rubber materials (natural, SBR, nitrile, etc.).

EP21TDCHT

100/100

“A” clear
“B” amber

100,000-120,000

60-90

48 hrs @ RT
2-3 hrs @ 200°F

-100 to +350°F

High temperature resistant general purpose system.  Excellent adhesion to a wide variety of substrates.

EP21TDCS

100/100

“A” silver
“B” silver

smooth paste

30-40

24-36 hrs @ RT
1-2 hrs @ 200°F

4°K to +250°F

High performance, silver filled, toughened system with excellent bond strength and cryogenic applicability.

EP21TPND

100/100

“A” black
“B” tan

thixotropic
paste

30-45

48-60 hrs @ RT
1-2 hrs @ 200°F

-60 to +250°F

Polysulfide modified version of EP21.  Fuel and oil resistant sealant.

EP21TP-2

100/100

“A” clear
“B” amber

1,500-2,000

30-45

48-60 hrs @ RT
1-2 hrs @ 200°F

-60 to +250°F

Low viscosity version of EP21TPND.  Ideal for potting and encapsulating.

EP22

100/100

“A” gray
“B” gray

paste

60-90

10 hrs @ RT
2 hrs @ 200°F

-60 to +250°F

Aluminum filled epoxy featuring exceptional dimensional stability and machinability.

EP24

100/100

“A” gray
“B” tan

50,000-60,000

10-20

12 hrs @ RT
30-45 min @ 200°F

-60 to +250°F

Faster curing version of EP21.  Capable of curing at below 40°F.  Ideal for field applications.

EP27

100/50

“A” clear
“B” amber

2,100-2,500

25-30

12-24 hrs @ RT
1-2 hrs @ 200°F

-60 to +250°F

Superb coating/liner.  Will cure below 40°F.  Outstanding chemical resistance. 

EP29LP

100/50

“A” clear
“B” clear

800

> 6 hrs

5-7 days @ RT
4-6 hrs @ 200°F

-60 to +250°F

Transparent.  Low viscosity, low exotherm, long working life system for bonding, casting and filament winding. 

EP29LPSP

100/65

“A” clear
“B” translucent

700

> 6 hrs

5-7 days @ RT
8-12 hrs @ 150°F

4°K to +250°F

Cryogenic version of EP29LP.  Can withstand cryogenic shock.  NASA low outgassing approved.  Transparent.

EP30

100/25

“A” clear
“B” clear

400-500

25-30

18-24 hrs @ RT
1-2 hrs @ 200°F

-60 to +250°F

Low viscosity transparent adhesive, sealant, coating and potting epoxy.  Exceptionally low shrinkage.

EP30MED

100/25

“A” clear
“B” clear

1,600-1,800

30-40

24-48 hrs @ RT
2-3 hrs @ 200°F

-60 to +250°F

Medical version of EP30.  USP Class VI certified.  Also meets food grade specifications. Transparent.

EP30-1

100/25

“A” clear
“B” clear

1,500-1,600

30-35

24-48 hrs @ RT
2 hrs @ 200°F

-60 to +250°F

Lower viscosity transparent system for fiber optic bonding, coating, potting and encapsulation.

EP30-2 

100/10

“A” clear
“B” clear

1,800-2,000

20-25

24 hrs @ RT
1-2 hrs @ 200°F

-60 to +250°F

Clear system for optical and fiber optic bonding & sealing.  Superb chemical resistance.  Transparent.

EP30-3

100/33

“A” clear
“B” clear

5,000-6,000

12-18 hrs

30-45 min @ 160°F
plus 2-3 hrs @ 300°F

-60 to +435°F

Transparent, high temperature, high chemical resistant version of EP30.  Requires heat cure.

EP30-4

100/50

“A” clear
“B” clear

2,000

4-10

8-12 hrs @ RT

-60 to +250°F

Very fast curing transparent epoxy system.  Superior non-yellowing properties.

EP30AO

100/10

“A” off white
“B” clear

15,000-20,000

30-40

24-36 hrs @ RT
1-2 hr @ 200°F

-60 to +250°F

Low viscosity, thermally conductive system.  Ideal for potting and encapsulation.  Good dimensional stability.

EP30AN

100/10

“A” gray
“B” clear

20,000-30,000

30-40

24-36 hrs @ RT
1-2 hrs @ 200°F

-60 to +250°F

Higher thermally conductive version of EP30AO. Special NASA low outgassing version also available (EP30AN-1).

EP30D-7

100/15

“A” black
“B”  yellow

40,000-50,000

45-50

36-48 hrs @ RT
2-2½ hrs @ 200°F

-60 to +250°F

Highly flexible, abrasion resistant adhesive, sealant, coating and encapsulant.

EP30D-10

100/5

“A” clear
“B” clear

>120,000

3-4 hrs

3-4 days @ RT
3-4 hrs @ 200°F

-60 to +250°F

High viscosity.  Very flexible with high elongation.  Transparent.  For bonding and sealing. 

EP30DP

100/10

“A” light amber
“B” clear

3,000-4,000

60-90

48 hrs @ RT
2-3 hrs @ 200°F

4°K to +250°F

Toughened sealant, potting and encapsulating material.  Allows for repairability.  Cryogenically servicable.

EP30FL

100/25

“A” amber
“B” clear

2,000-3,000

25-30

24 hrs @ RT
1-2 hrs @ 200°F

4°K to +250°F

Low viscosity, flexible, for high performance potting, encapsulating and sealing.  Cryogenically serviceable.

EP30HT

100/25

“A” clear
“B” clear

35,000-45,000

25-35

24 hrs @ RT
1-2 hrs @ 200°F

-60 to +400°F

High temperature resistant version of EP30, transparent, system for bonding, sealing, coating and casting.

EP30LTE

100/10

“A” black
“B” clear

15,000-20,000

30-40

24-48 hrs @ RT
2-3 hrs @ 200°F

-60 to +250°F

Exceptionally low coefficient of expansion system with very low shrinkage & high dimensional stability.

EP30M3LV

100/50

“A” black
“B” brown

2,000-3,000

130-150

48-72 hrs @ RT
3-4 hrs @ 200°F

-60 to +250°F

For potting, casting and encapsulation.  Low exotherm.  Long working life.  Excellent for capacitors.

EP30R

100/25

“A” yellow
“B” yellow

paste

30-35

24 hrs @ RT
2-3 hrs @ 200°F

-60 to +250°F

Fiber reinforced, high performance structural epoxy for bonding.  Rigid with high impact resistance.

EP31

100/33

“A” clear
“B” clear

2,000-3,000

30-40

24-36 hrs @ RT
2 hrs @ 200°F

-60 to +250°F

Ultra high strength adhesive in both tensile and peel modes.  Lap shear over 4,500 psi.

EP33

100/70

“A” gray
“B” amber

50,000-60,000

50-60

24-48 hrs @ RT
1-2 hrs @ 200°F

-60 to +450°F

High temperature resistant adhesive/sealant.  Can resist high radiation levels.  Good physical strength properties.

EP34

100/70

“A” black
“B” amber

70,000-80,000

50-60

24-48 hrs @ RT
1-2 hrs @ 200°F

-60 to +450°F

Mineral filled version of EP33.  Superior electrical insulation properties.

EP34CA

100/50

“A” black
“B” brown

5,000-6,000

12-24 hrs

1 hr @ 150°F plus
2-3 hrs @ 300°F

-60 to +500°F

Ultra high temperature resistant lower viscosity system for filament winding, potting & bonding.  Requires heat cure.

EP35

100/70

“A” gray
“B” amber

70,000-80,000

50-60

24-48 hrs @ RT
1-2 hrs @ 200°F

-60 to +450°F

Specially filled version of EP33.  Enhanced dimensional stability.

EP37-3

100/50

“A” clear
“B” clear

300-400

>6 hrs

5-7 days @ RT
4-6 hrs @ 200°F

-80 to +250°F

Low viscosity, low exotherm, transparent, slightly flexible.  Exceptionally long working life.  For bonding and potting.

EP37-3FLF

100/100

“A” clear
“B” clear

1,500-1,800

120-150

48-72 hrs @ RT
3 hrs @ 200°F

4°K to +250°F

Highly flexible version of EP37-3.  Transparent.  For bonding, sealing & potting.  Cryogenically serviceable.

EP37-3FLFAO

100/100

“A” white
“B” white

18,000-22,000

3 hrs

4-5 days @ RT
4-6 hrs @ 200°F

4°K to +250°F

Thermally conductive version of EP37-3FLF.  For potting & encapsulation. Repairable.  Cryogenically serviceable.

EP39-2

100/50

“A” clear
“B” clear

2,000-3,000

30-35

4-6 hrs @ RT

-60 to +300°F

Low viscosity.  Fast curing.  Used often as an optical adhesive/sealant and for chemically resistant coatings.

EP39M

100/75

“A” black
“B” clear

3,000-4,000

35-40

24 hrs @ RT
1 hr @ 200°F

-60 to +350°F

Heat resistant adhesive/coating and encapsulant for capacitors and other electronic components.

EP41S-1

100/30

“A” clear
“B” amber

6,000-7,000

25-30

24-36 hrs @ RT
1-2 hrs @ 200°F

-60 to +300°F

Special high performance epoxy with outstanding resistance to organic solvents, alcohols and fuels.

EP41S-4

100/25

“A” black
“B” clear

3,000-4,000

15-20

24 hrs @ RT
1-2 hrs @ 200°F

-60 to +300°F

Chemically resistant to chlorinated solvents and acids.  For coatings & high security potting applications.

EP42HT

100/40

“A” clear
“B” amber

8,000-10,000

35-45

24-36 hrs @ RT
2-3 hrs @ 200°F

-60 to +435°F

USP Class VI.  Resists repeated chemical, ETO, radiation and steam sterilization.  For bonding,  potting & sealing.

EP42LV

100/40

“A” clear
“B” amber

2,000-2,300

25-35

24-36 hrs @ RT
2-3 hrs @ 200°F

-60 to +300°F

Low viscosity, highly chemical resistant coating, casting and bonding system.

EP45HT

100/30

“A” clear
“B” brown

40,000-50,000

12-24 hrs

1 hr @ 150°F plus
2-3 hrs @ 300°F

-80 to +500°F

High temperature and chemically resistant structural adhesive/sealant.  MMM-A-132 type III.  Requires heat cure.

EP50

100/100

“A” clear
“B” clear yellow

8,000-10,000

45 sec

5-15 min @ RT

-60 to +250°F

Super high-speed curing adhesive for structural  bonding.

EP50-1.5

100/100

“A” clear
“B” clear yellow

8,000-10,000

90-120 sec

2-3 hrs @ RT

4°K to +250°F

Very fast setting, cryogenic adhesive/sealant.  Also available in thermally conductive version (EP50-1.5AO). 

EP51

100/100

“A” clear
“B” tan

10,000-12,000

5 min

4-6 hrs @ RT

4°K to +250°F

Fast curing, general purpose  “5 minute” epoxy.  Excellent long term durability.  Cryogenically serviceable.

EP51HT

100/100

“A” clear
“B” tan

60,000-70,000

5 min

4-6 hrs @ RT

-60 to +350°F

Higher heat resistant (350°F) version of EP51 epoxy resin system.

EP51M

100/100

“A” amber
“B” tan

8,000-9,000

3 min

3-3½ hrs @ RT

4°K to +250°F

“3 minute” gel version of EP51 epoxy resin system.  Cryogenically serviceable.

EP62-1

100/5 or
100/10

“A” clear
“B” tan

8,000-10,000

8-10 hrs

4-6 hrs @ 150°F or
2-3 hrs @ 200°F

-60 to +300°F

High temperature, high chemical resistant adhesive/sealant.  Long working life.  Requires cure at 150-200°F.

EP65HT-1

100/10

“A” clear
“B” dark purple

60,000-70,000

3-5

20-30 min @ RT

-60 to +400°F

Ultra-fast curing adhesive.  Resists high temperatures, high bond strength, NASA  low outgassing approved.

EP72M3

100/100

“A” black
“B” white

100,000-120,000

90-120

48-72 hrs @ RT
2-3 hrs @ 200°F

-60 to +275°F

Flexibilized system with exceptionally high impact resistance.  High lap shear & peel strength.

EP75-1

100/15

“A” dk gray/black
“B” clear

paste

60

24-48 hrs @ RT
1-2 hrs @ 200°F

-60 to +250°F

Electrically conductive (graphite filled) epoxy adhesive/sealant.

EP76M

100/100

“A” gray
“B” gray

paste

60

24-48 hrs @ RT
2-3 hrs @ 200°F

-60 to +250°F

Electrically conductive (nickel filled) epoxy adhesive/sealant.  Convenient mix ratio.

EP77M-F

100/100

“A” silver
“B” silver

smooth paste

5-10

4-8 hrs @ RT

-60 to +250°F

Electrically conductive, silver filled epoxy adhesive/sealant.  Convenient mix.  Very fast cure time.

EP110F6

50/100

“A” clear
“B” amber

15,000-20,000

12-24 hrs @ RT

60-90 min @ 150°F
plus  6-8 hrs @ 300°F

-55 to +155°C

For sealing and potting.  Superior thermal shock resistance.  Meets MIL-I-16923C.  Requires heat cure.

EP112

100/80

“A” clear
“B” clear

300-400

>24 hrs

2-3 hrs @ 200°F plus 6-10 hrs @ 300°F

-60 to 500°F

Extraordinary electrical insulation properties.  Clear, ultra-thin sealant/encapsulant..  Non-yellowing.  Requires heat cure.

EP121CL

100/80

“A” clear
“B” clear

2,000-3,000

>24 hrs

3 hrs @ 200°F
plus 8-10 hrs@300°F

-60 to 500°F

Low viscosity, 500°F potting/impregnant.  Exceptional electrical insulation properties.  Requires heat cure.

EP121AO

100/80

“A”white
“B” white

35,000-45,000

12-24 hrs

3 hrs @ 200°F plus 8-10 hrs @ 300°F

-60 to 500°F

Thermally conductive version of EP121CL.  For high temperature potting & encapsulation.   Requires heat cure.

EP125

100/50

“A” gray
“B” yellow powder

paste

not applicable

1 hr @ 180°F plus
1 hr @ 300°F plus
2 hrs @ 400°F

-60 to 600°F

Super high temperature resistant system capable of 600°F temperature service. Requires heat cure.

Black Magic HT

100/100

“A” black
“B” black

paste

60

24-48 hrs @ RT

-60 to +400°F

For durable, high performance, abrasion resistant coatings, liners and sealant.

SuperGel #7

100/100

“A” clear
“B” clear

500

> 3 hrs

48-72 hrs @ RT
3 hrs @ 200°F

-60 to +200°F

Soft, resilient, transparent epoxy gel for encapsulation of electronic components and circuitry.

Supreme 11

100/100

“A” gray
“B” tan

30,000-40,000

40-50

18-24 hrs @ RT
30-45 min @ 200°F

-100 to +275°F

High peel strength, high performance epoxy adhesive system.  Excellent thermal shock resistance.

Supreme 11AOHT

100/100

“A” gray
“B” white

paste

25-50

24-36 hrs @ RT

1 hr @ 200°F

-100 to +400°F

Thermally conductive version of Supreme 11HT.
Convenient 1/1 ratio, good electrical insulation properties.

Supreme 11HT

100/100

“A” gray
“B” tan

125,000-135,000

20-30

18-24 hrs @ RT
30-45 min @ 200°F

-100 to +400°F

Heat resistant version of Supreme 11.  Good mechanical and physical strength properties.

Supreme 45HT

100/30

“A” tan
“B” brown

65,000-75,000

12-24 hrs

1 hr @ 150°F plus
2-3 hrs @ 300°F

-80 to +450°F

Toughened version of EP45HT.  Well suited for bonding dissimilar substrates.  Superb sealant.  Requires heat cure.

Supreme 45HTQ

100/30

“A” tan
“B” brown

100,000-120,000

12-24 hrs

1 hr @ 150°F plus 3-4 hrs @ 300°F

-80 to +450°F

Mineral filled version of Supreme 45HT.  Enhanced dimensional stability. Requires heat cure.

SteelMaster 43HT

100/20

“A” dark gray
“B” tan

thixotropic
paste

20-30

24 hrs @ RT
1-2 hrs @ 200°F

-60 to +400°F

Machinable, stainless steel filled, for repairing metallic parts & bonding carbide to steel.  Ultra high compressive strength.