EP21AN Product Description

Master Bond Polymer Adhesive EP21AN is a two component, room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has a forgiving one to one mix ratio by weight or volume. Although the system cures at room temperature, its physical properties are optimized by a post cure at 150°F for 2-3 hours. As a thermally conductive adhesive it will adhere to a wide variety of substrates and offers a tensile shear strength exceeding 1,100 psi. Other noteworthy features include superior electrical insulation properties and superb dimensional stability. EP21AN offers good resistance to a wide range of chemicals including water, oil, fuels, and various solvents over the temperature range of -60°F to +250°F. EP21AN is widely used in the electronic, electro-optical, and related industries where excellent heat transfer and electrical insulation are required. The color of Part A is light gray; Part B is gray in color. EP21ANLV-1 has excellent flow and is well suited for potting and encapsulation applications in the electronic industry.

Product Advantages

• Low coefficient of expansion, low shrinkage and superb dimensional stability.
• Convenient mixing: non-critical equal weight or volume ratio.
• Easy application: contact pressure only required for cure; adhesive spreads evenly; self leveling feature.
• Versatile cure schedules: ambient temperature cures or fast elevated temperature cures.
• High bonding strength to a wide variety of substrates.
• Superior durability, thermal shock and chemical resistance.
• Outstanding thermal conductivity, over 22 BTU•in/ft2 •hr•°F.
• Excellent electrical insulation properties.
• Long working life.