Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It develops a high bonding strength of 2200 psi at ambient temperatures and retains significant strength even upon exposures to temperatures as high as 400°F. The bonds produced are both tough and durable as well as resistant to thermal cycling and many chemicals including water, fuels and most organic solvents. It has a service temperature range of 4K up to 400°F. It adheres well to metals, glass, ceramics, wood, vulcanized rubbers and many plastics. The hardened adhesive exhibits high thermal conductivity and yet is a superior electrical insulator. The thermal expansion coefficient is remarkably low. Master Bond Polymer System EP21TCHT-1 is widely used in electronics, electrical, construction, metalworking, appliance, automotive and chemical industries. As a NASA qualified system, it is ideal for high vacuum type applications, particularly those where elevated temperature cures are not possible.