
EP37-3FLF Product Description
Low Viscosity, Optically Clear Two Component Room Temperature Curing Epoxy Resin System for High Performance Bonding, Casting and Coating Applications Featuring Long Working Life and Low Exotherm Along With Very High Flexibility
Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a forgiving onetoone mix ratio by weight or volume. As an adhesive, it forms very flexible high strength bonds that offer excellent impact resistance as well as resistance to severe thermal cycling and shock. It bonds well to a wide variety of substrates including metals, glass, ceramics, rubber and many plastics.
EP37-3FLF is also a superb potting, encapsulating and casting system. Its relatively low exotherm makes it an ideal material for large castings. In this regard it also possesses superior electrical insulation properties. The combination of high flexibility and lower exotherm helps prevent EP37-3FLF from stressing sensitive electronic components during cure. Also noteworthy is the long working life which, depending upon mass, could offer an hour or two at room temperature conditions. EP37-3FLF is serviceable over the very wide temperature range form from 4K to +250°F. This versatile system is widely used in optical, electronic, electrical, computer and OEM type applications.
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- Epoxy |
- Heat Cure |
- Room Temperature Cure |
- Cryogenic |
- Electrically Insulative |
- Low Viscosity |
- Optically Clear |
- High Peel Strength |
- Thermal Cycling Resistant |
- Flexibilized & Toughened |
- Vibration, Shock & Impact |
- Low Stress |

